12 inji ah oo si buuxda otomaatig ah u shaqeeya Qalabka Mishiinka Dicing Wafer Nidaamka Jarida ee loogu talagalay Si/SiC & HBM (Al)
Xuduudaha farsamada
| Halbeegga | Faahfaahinta |
| Cabbirka Shaqada | Φ8", Φ12" |
| Spindle | Dhidib laba-geesood ah 1.2/1.8/2.4/3.0, ugu badnaan 60000 rpm |
| Cabbirka daabyada | 2" ~ 3" |
| Dhidibka Y1 / Y2
| Kordhinta hal-tallaabo: 0.0001 mm |
| Saxnaanta booska: < 0.002 mm | |
| Kala duwanaanshaha jarista: 310 mm | |
| Dhidibka X | Xawaaraha quudinta: 0.1–600 mm/s |
| Dhidibka Z1 / Z2
| Kordhinta hal-tallaabo: 0.0001 mm |
| Saxnaanta booska: ≤ 0.001 mm | |
| θ Dhidibka | Saxnaanta booska: ±15" |
| Saldhigga Nadiifinta
| Xawaaraha wareegga: 100–3000 rpm |
| Habka nadiifinta: Si otomaatig ah u raaci oo u qalaji | |
| Danabka Hawlgalka | 3-waji 380V 50Hz |
| Cabbirrada (Qolalka × D × H) | 1550 × 1255 × 1880 mm |
| Miisaanka | 2100 kg |
Mabda'a Shaqada
Qalabku wuxuu gaaraa jarista saxda ah ee sare iyada oo loo marayo tiknoolajiyada soo socota:
1. Nidaamka Isgoysyada Adkaanta Sare leh: Xawaaraha wareega ilaa 60,000 RPM, oo lagu qalabeeyay daabyo dheeman ah ama madaxyo laysar ah si ay ula qabsadaan sifooyinka kala duwan ee walxaha.
2. Xakamaynta Dhaqdhaqaaqa Dhinacyada Badan: Saxnaanta booska dhidibka X/Y/Z ee ±1μm, oo lagu daray miisaannada shabagga ee saxnaanta sare leh si loo hubiyo waddooyinka jarista ee aan leexashada lahayn.
3. Iswaafajinta Muuqaalka ee Caqliga leh: CCD-ga xallinta sare leh (5 megapixels) si toos ah ayuu u aqoonsanayaa jarista waddooyinka wuxuuna magdhowayaa isbeddelka walxaha ama si khaldan u socda.
4. Qaboojinta & Ka saarista Boorka: Nidaamka qaboojinta biyaha saafiga ah ee isku dhafan iyo ka saarista boodhka faakiyuumka si loo yareeyo saameynta kulaylka iyo wasakhowga walxaha.
Qaababka Jarida
1. Laalaabidda Daabka: Ku habboon agabka semiconductor-ka dhaqameed sida Si iyo GaAs, oo leh ballaca kerf ee 50–100μm.
2. Dicing-ka Laser-ka ee qarsoon: Waxaa loo isticmaalaa wafer-yada aadka u khafiifsan (<100μm) ama walxaha jilicsan (tusaale ahaan, LT/LN), taasoo suurtogalinaysa kala-soocid aan walwal lahayn.
Codsiyada Caadiga ah
| Alaab Ku Habboon | Goobta Codsiga | Shuruudaha Hawlgalka |
| Silikoon (Si) | ICs, dareemayaasha MEMS | Goynta saxda ah ee sare, jajabka <10μm |
| Silikoon Karbohaydrayt (SiC) | Aaladaha korontada (MOSFET/diode) | Goynta waxyeello yar, hagaajinta maaraynta kulaylka |
| Gallium Arsenide (GaAs) | Qalabka RF, jajabyada optoelectronic | Ka hortagga micro-crack, xakamaynta nadaafadda |
| Substrates-ka LT/LN | Shaandheeyayaasha SAW, modulators indhaha | Jaritaan aan walwal lahayn, ilaalinta sifooyinka piezoelectric |
| Substrates-ka dhoobada ah | Modules-ka korontada, baakadaha LED-ka | Habaynta walxaha adag ee sare, fidsanaan gees ah |
| Qaababka QFN/DFN | Baakad horumarsan | Goynta isku mar ah ee Multi-chip, hagaajinta hufnaanta |
| Waferada WLCSP | Baakad heer-wafer ah | Kala-goynta aan waxyeello lahayn ee buskudka aadka u khafiifsan (50μm) |
Faa'iidooyinka
1. Sawir-qaadista qaabka cajaladda xawaaraha sare leh oo leh digniino ka hortagga isku dhaca, meelaynta wareejinta degdegga ah, iyo awood sixitaan khaladaad oo xooggan.
2. Habka jarista laba-isbuunlaha ah ee la hagaajiyay, taasoo kor u qaadaysa hufnaanta qiyaastii 80% marka la barbar dhigo nidaamyada hal-isbuunlaha ah.
3. Boolal kubbadeed oo si sax ah loo soo dhoofiyay, hagayaal toosan, iyo xakamaynta wareegga wareegsan ee Y-dhidibka, taasoo hubinaysa xasilloonida muddada dheer ee mashiinka saxda ah ee sare.
4. Rarista/soo dejinta si buuxda oo otomaatig ah, meelaynta wareejinta, jarista isku-xidhka, iyo kormeerka kerf, taasoo si weyn u yareynaysa culayska shaqada ee hawlwadeenka (OP).
5. Qaab-dhismeedka rakibidda spindle-ka qaabka Gantry, oo leh ugu yaraan laba-daab oo u dhexeeya 24mm, taasoo suurtogalinaysa la qabsi ballaaran oo loogu talagalay hababka jarista laba-daab.
Astaamaha
1. Cabbiraadda dhererka aan taabashada lahayn oo sax ah.
2. Goynta laba-daab ee badan oo leh hal saxaarad.
3. Habaynta otomaatiga ah, kormeerka kerf, iyo nidaamyada ogaanshaha jabka daabka.
4. Waxay taageertaa habab kala duwan oo leh algorithms-ka iswaafajinta otomaatiga ah ee la dooran karo.
5. Shaqada is-saxitaanka khaladka ah iyo kormeerka booska badan ee waqtiga-dhabta ah.
6. Awoodda kormeerka ee ugu horreysa ee la jarjaray ka dib marka la gooyo.
7. Qaybaha otomaatiga ah ee warshadda ee la habeyn karo iyo hawlo kale oo ikhtiyaari ah.
Adeegyada Qalabka
Waxaan bixinaa taageero dhammaystiran laga bilaabo xulashada qalabka ilaa dayactirka muddada dheer:
(1) Horumarinta La Habeeyey
· Ku talin xalalka jarista daabka/laysarka iyadoo lagu saleynayo sifooyinka agabka (tusaale ahaan, adkaanta SiC, jajabka GaAs).
· Bixi tijaabo muunad bilaash ah si loo xaqiijiyo tayada jarista (oo ay ku jiraan jajabka, ballaca kerf, qallafsanaanta dusha sare, iwm.).
(2) Tababar Farsamo
· Tababar Aasaasi ah: Hawlgalka qalabka, hagaajinta xuduudaha, dayactirka joogtada ah.
· Koorsooyin Sare: Hagaajinta habka ee agabka adag (tusaale ahaan, jarista substrate-ka LT-ka ee aan walwalka lahayn).
(3) Taageerada Iibka Kadib
· 24/7 Jawaab: Baaritaanka fog ama caawinta goobta.
· Qalabka Kaydka ah: Qalabka kaydka ah, daabyada, iyo qaybaha indhaha si loogu beddelo si dhakhso ah.
· Dayactirka Ka Hortagga: Hagaajinta joogtada ah si loo ilaaliyo saxnaanta loona kordhiyo cimriga adeegga.
Faa'iidooyinkayaga
✔ Khibrad Warshadeed: U adeegta 300+ soosaarayaasha semiconductor-ka caalamiga ah iyo qalabka elektaroonigga ah.
✔ Tiknoolajiyadda Casriga ah: Tilmaamaha toosan ee saxda ah iyo nidaamyada servo waxay hubiyaan xasilloonida hormuudka ka ah warshadaha.
✔ Shabakadda Adeegga Caalamiga ah: Daboolista Aasiya, Yurub, iyo Waqooyiga Ameerika si loogu helo taageero maxalli ah.
Wixii baaritaan ama su'aalo ah, nala soo xiriir!












