8Inch 200mm 4H-N SiC Wafer Conductive naasaha darajo cilmi baaris

Sharaxaad Gaaban:

Sida gaadiidka, tamarta iyo suuqyada warshadaha ay horumariyaan, baahida loo qabo la isku halayn karo, waxqabadka sare ee korantada ayaa sii socota inay koraan. Si loo daboolo baahiyaha waxqabadka semiconductor-ka ee la hagaajiyay, soosaarayaasha aaladaha ayaa eegaya agabka semiconductor-ka ballaaran, sida 4H SiC Prime Grade portfolio ee 4H n-nooca silikoon carbide (SiC) wafers.


Faahfaahinta Alaabta

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Iyada oo ay ugu wacan tahay sifooyinkeeda gaarka ah ee jirka iyo elektiroonigga ah, 200mm SiC wafer semiconductor wafer waxaa loo isticmaalaa in lagu abuuro wax qabad sare, heerkul sare, shucaac u adkaysta, iyo aaladaha elektiroonigga ah ee soo noqnoqda. 8inch SiC substrate qiimaha ayaa si tartiib tartiib ah hoos ugu dhacaya marka tignoolajiyada ay noqoto mid horumarsan oo baahidu korodho. Horumarinta tignoolajiyada dhawayd waxay horseed u tahay wax soo saarka miisaanka wax soo saarka ee 200mm wafers SiC. Faa'iidooyinka ugu muhiimsan ee qalabka semiconductor ee SiC wafer marka la barbardhigo Si iyo GaAs wafers: Awoodda beerta korantada ee 4H-SiC inta lagu jiro burburka qulqulka ayaa ka badan amar ka sarreeya qiyamka u dhigma ee Si iyo GaAs. Tani waxay keenaysaa hoos u dhac weyn oo ku yimaadda iska caabbinta gobolka ee Ron. Iska caabbinta hoose ee gobolka, oo ay weheliso cufnaanta sare ee hadda jirta iyo kulaylka kuleylka, waxay u oggolaaneysaa isticmaalka dhimashada aadka u yar ee qalabka korontada. Heerarka kulaylka sare ee SiC wuxuu yareeyaa caabbinta kulaylka ee chip. Qalabka elektiroonigga ah ee aaladaha ku saleysan waferrada SiC waa kuwo aad u xasilloon waqti ka dib iyo heerkul deggan, taas oo hubinaysa kalsoonida sare ee alaabada. Silicon carbide aad bay ugu adkaysanaysaa shucaaca adag, kaas oo aan hoos u dhigin sifooyinka elektarooniga ah ee chip-ka. Heerkulka sare ee xaddidaadda shaqada ee crystal (in ka badan 6000C) waxay kuu ogolaaneysaa inaad abuurto qalab aad loogu kalsoon yahay xaaladaha adag ee hawlgalka iyo codsiyada gaarka ah. Waqtigan xaadirka ah, waxaan ku siin karnaa dufcad yar oo 200mmSiC wafers si joogto ah oo joogto ah oo waxaan ku yeelan karnaa xoogaa bakhaar ah.

Tilmaamid

Lambarka Shayga Unug Wax soo saar Cilmi baaris nacasnimo
1. Halbeegyada
1.1 nooca badan -- 4H 4H 4H
1.2 jihaynta dusha sare ° <11-20>4±0.5 <11-20>4±0.5 <11-20>4±0.5
2. Qalabka korantada
2.1 dopanant -- n-nooca Nitrogen n-nooca Nitrogen n-nooca Nitrogen
2.2 iska caabin ah ·cm 0.015-0.025 0.01-0.03 NA
3. Mechanical parameter
3.1 dhexroorka mm 200±0.2 200±0.2 200±0.2
3.2 dhumucdiisuna μm 500± 25 500± 25 500± 25
3.3 Hanuuninta darajada ° [1- 100]±5 [1- 100]±5 [1- 100]±5
3.4 Qoto dheer mm 1 ~ 1.5 1 ~ 1.5 1 ~ 1.5
3.5 LTV μm ≤5(10mm*10mm) ≤5(10mm*10mm) ≤10 (10mm*10mm)
3.6 TTV μm ≤10 ≤10 ≤15
3.7 Qaansada μm -25 ~ 25 -45-45 -65-65
3.8 Warp μm ≤30 ≤50 ≤70
3.9 AFM nm Ra≤0.2 Ra≤0.2 Ra≤0.2
4. Qaab dhismeed
4.1 cufnaanta micropipe ee/cm2 ≤2 ≤10 ≤50
4.2 maadada birta ah atamka/cm2 ≤1E11 ≤1E11 NA
4.3 TSD ee/cm2 ≤500 ≤1000 NA
4.4 BPD ee/cm2 ≤2000 ≤5000 NA
4.5 TED ee/cm2 ≤7000 ≤10000 NA
5. Tayo wanaagsan
5.1 hore -- Si Si Si
5.2 dusha sare dhammayn -- Si-wejiga CMP Si-wejiga CMP Si-wejiga CMP
5.3 qayb ea/wafer ≤100 (xajmiga≥0.3μm) NA NA
5.4 xoqin ea/wafer ≤5, Wadarta Dhererka≤200mm NA NA
5.5 Cidhif
chips/indents/ dildilaaca/ wasakhowga
-- Midna Midna NA
5.6 Aagagga nooca badan -- Midna Aagga ≤10% Aagga ≤30%
5.7 calaamadaynta hore -- Midna Midna Midna
6. Tayada dhabarka
6.1 dib u dhammayn -- C-waji xildhibaan C-waji xildhibaan C-waji xildhibaan
6.2 xoqin mm NA NA NA
6.3 Cilladaha dhabarka gees
chips/indents
-- Midna Midna NA
6.4 Dhabar xumada nm Ra≤5 Ra≤5 Ra≤5
6.5 Calaamadaynta dhabarka -- Darajo Darajo Darajo
7. gees
7.1 gees -- Chamfer Chamfer Chamfer
8. Xidhmada
8.1 baakad -- Epi- diyaar u ah faakuum
baakad
Epi- diyaar u ah faakuum
baakad
Epi- diyaar u ah faakuum
baakad
8.2 baakad -- Multi-wafer
baakad cajalad
Multi-wafer
baakad cajalad
Multi-wafer
baakad cajalad

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