p-nooca 4H/6H-P 3C-N TYPE SIC substrate 4inch 〈111〉± 0.5°Zero MPD
4H/6H-P Nooca SiC Substrates Composite Substrates Miis cabbirka guud
4 dhexroorka inch SiliconSubstrate-ka Carbide (SiC). Tilmaamid
Darajo | Wax soo saarka MPD eber Darajada (Z Darajo) | Wax soo saarka caadiga ah Darajada (P Darajo) | Dummy Fasalka (D Darajo) | ||
Dhexroorka | 99.5 mm ~ 100.0 mm | ||||
Dhumucda | 350 μm ± 25 μm | ||||
Hanuuninta Wafer | dhidibka ka baxsan: 2.0°-4.0° dhanka [1120] ± 0.5° loogu talagalay 4H/6H-P, On dhidibka:〈111〉± 0.5° ee 3C-N | ||||
Cufnaanta Dheef-yar | 0 cm-2 | ||||
iska caabin | p-nooca 4H/6H-P | ≤0.1 Ωꞏcm | ≤0.3 Ωꞏcm | ||
n-nooca 3C-N | ≤0.8 mΩꞏcm | ≤1 m Ωꞏcm | |||
Hanuuninta Flat Primary | 4H/6H-P | - {1010} ± 5.0° | |||
3C-N | - {110} ± 5.0° | ||||
Dhererka Guriga aasaasiga ah | 32.5 mm ± 2.0 mm | ||||
Dhererka Guriga Sare | 18.0 mm ± 2.0 mm | ||||
Hanuuninta Guriga Sare | Silicon weji kor ah: 90° CW. ka yimid dabaqa Prime±5.0° | ||||
Ka saarida gees | 3 mm | 6 mm | |||
LTV/TTV/Bow/Warp | ≤2.5 μm/≤5 μm/≤15 μm/≤30 μm | ≤10 μm/≤15 μm/≤25 μm/≤40 μm | |||
Qalafsanaan | Polish Ra≤1 nm | ||||
CMP Ra≤0.2 nm | Ra≤0.5 nm | ||||
Dildilaaca Cidhifyada Iftiinka Xoogan Sare | Midna | Dhererka isugeynta ≤ 10 mm, hal dherer≤2 mm | |||
Taarikada Hex By Iftiin Xoogan Sare | Aagga wadarta ≤0.05% | Aagga isugeynta ≤0.1% | |||
Meelo Badan Oo Iftiin Xoogan Sare leh | Midna | Aagga isugeynta≤3% | |||
Kaarboon Muuqaal ah | Aagga wadarta ≤0.05% | Aagga isugeynta ≤3% | |||
Dusha sare ee Silikoon xoqida Iftiinka Xoogan Sare | Midna | Dhererka isugeynta≤1× dhexroorka wafer | |||
Chips-ka Cidhifka Sare ee Iftiinka Xooga | Midna lama oggola ≥0.2mm ballac iyo qoto dheer | 5 waa la ogol yahay, ≤1 mm midkiiba | |||
Wasakhaynta Silikoonka Dusha Sare ee Xooggiisa | Midna | ||||
Baakadaha | Cassette Multi-wafer ah ama Konteenar Wafer Keliya ah |
Xusuusin:
※ Xadka cilladuhu waxay khuseeyaan dhammaan dusha sare ee waferka marka laga reebo aagga ka saarista cidhifka. # xagashada waa in lagu fiiriyaa wejiga Si kaliya.
Nooca P-nooca 4H/6H-P 3C-N nooca 4-inch SiC substrate oo leh 〈111〉± 0.5° hanuuninta iyo eber MPD darajada ayaa si weyn loogu isticmaalaa codsiyada elektarooniga ah ee waxqabadka sareeyo. Korontada kuleylkeeda aadka u wanaagsan iyo korontada sare ee burburka ayaa ka dhigaysa mid ku habboon korantada elektiroonigga ah, sida furayaasha korantada sare, beddelayaasha, iyo beddelayaasha awoodda, oo ku shaqeynaya xaalado aad u daran. Intaa waxaa dheer, iska caabbinta substrate ee heerkulka sare iyo daxalka waxay hubisaa waxqabadka xasilloon ee jawiga adag. Hanuuninta saxda ah ee 〈111〉± 0.5° waxay kor u qaadaysaa saxnaanta wax soo saarka, taas oo ka dhigaysa mid ku habboon aaladaha RF iyo codsiyada soo noqnoqda, sida nidaamyada radar iyo qalabka isgaarsiinta wireless.
Faa'iidooyinka N-nooca SiC substrate-ka isku dhafan waxaa ka mid ah:
1. Heerarka Sare ee Heerarka: Kala-baxa kulaylka waxtarka leh, taas oo ka dhigaysa mid ku habboon jawiga heerkulka sare iyo codsiyada awoodda sare leh.
2. Korontada Burburka Sare: Waxay xaqiijisaa waxqabadka la isku halayn karo ee codsiyada korantada sare sida korantada iyo rogayaasha.
3. Zero MPD (Cilladda Micro Pipe) Darajooyinka: Waxay dammaanad qaadaysaa cilladaha ugu yar, siinta xasilloonida iyo isku halaynta sare ee aaladaha elektiroonigga ah ee muhiimka ah.
4. Iska-caabbinta Daxalka: Ku waara jawiga adag, hubinta shaqeynta muddada dheer ee xaaladaha baahida.
5. Saxan 〈111〉± 0.5 ° Hanuuninta: Waxay u ogolaataa toosinta saxda ah inta lagu jiro wax soo saarka, hagaajinta waxqabadka qalabka ee soo noqnoqoshada sare iyo codsiyada RF.
Guud ahaan, nooca P-nooca 4H/6H-P 3C-N nooca 4-inch SiC substrate oo leh 〈111〉± 0.5° hanuuninta iyo Zero MPD waa walax wax qabad sare leh oo ku habboon codsiyada elektiroonigga ah ee horumarsan. Kuleylkeeda heerkuleed ee ugu wanaagsan iyo korontada burburka sare waxay ka dhigaysaa mid ku habboon korantada elektiroonigga ah sida furayaasha korantada sare, beddelayaasha, iyo beddelayaasha. Darajada Zero MPD waxay hubisaa cilladaha ugu yar, siinta kalsoonida iyo xasilloonida aaladaha muhiimka ah. Intaa waxaa dheer, iska caabbinta substrate-ka ee daxalka iyo heerkulka sare waxay hubisaa adkeysiga jawiga adag. Hanuuninta saxda ah ee 〈111〉± 0.5° waxay u oggolaanaysaa toosinta saxda ah inta lagu jiro wax soo saarka, taasoo ka dhigaysa mid aad ugu habboon aaladaha RF iyo codsiyada soo noqnoqda.