Qalab Goynta Wafer-Guritaanka Si Toos ah oo Toos ah oo Dhameystiran

Qalab Goynta Wafer-Guritaanka Toos ah oo Si Toos ah u Dhashay Cabbirka Shaqeynaya 8inch/12inch

Sharaxaad Gaaban:

XKH waxay si madax-banaan u samaysay nidaam goynta cidhifyada wafer si toos ah, oo ka dhigan xal horumarsan oo loogu talagalay hababka wax soo saarka semiconductor-dhamaadka hore. Qalabkani waxa uu ka kooban yahay tignoolajiyada casriga ah ee dhidibada badan leh ee isku-dhafan, waxana uu leeyahay nidaam isbinaaj oo adag (xawaaraha ugu badan ee wareeg: 60,000 RPM), isagoo keenaya gooyn sax ah oo sax ah ilaa ± 5μm. Nidaamku waxa uu muujinayaa ku habboonaanta heer-sare ee kala duwan ee substrate-conductor, oo ay ku jiraan laakiin aan ku xaddidnayn:
1.Silicon wafers (Si): Ku habboon habaynta cidhifyada 8-12 inch wafers;
2.Compound semiconductors: Qalabka semiconductor-jiilka saddexaad sida GaAs iyo SiC;
3.Special substrates: Wafers walxaha Piezoelectric oo ay ku jiraan LT / LN;

Naqshadaynta qaab-dhismeedka waxay taageertaa beddelka degdegga ah ee alaabooyin badan oo ay ku jiraan dheemanka dheemanka iyo madax goynta laysarka, oo la socon kara heerarka warshadaha. Shuruudaha habraaca gaarka ah, waxaanu ku siinaynaa xalal dhamaystiran oo ka kooban:
• Sahayda agabka goynta ee go'ay
Adeegyada habaynta gaarka ah
· Hab-socod xalalka hagaajinta halbeegga

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Astaamaha

Xuduudaha farsamada

Halbeegga	Unug	Tilmaamid
Cabbirka ugu badan ee shaqada	mm	ø12"
Spinal	Habaynta	Spindle Single
	Xawaaraha	3,000-60,000 rpm
	Awoodda wax soo saarka	1.8 kW (2.4 ikhtiyaari ah) at 30,000 min⁻¹
	Max Blade Dia.	Ø58 mm
X- dhidibka	Goynta Range	310 mm
Y- dhidibka	Goynta Range	310 mm
	Kordhinta tilaabada	0.0001 mm
	Meelaynta Saxnaanta	≤0.003 mm/310 mm, ≤0.002 mm/5 mm (hal khalad)
Z-Axis	Xallinta Dhaqdhaqaaqa	0.00005 mm
Z-Axis	Ku celcelinta	0.001 mm
θ-Axis	Wareegga ugu sarreeya	380 deg
Nooca Spindle-ka		Midab keli ah, oo leh daab adag oo goynta giraanta
Saxnimada Goynta giraanta	μm	±50
Saxnaanta Meelaynta Wafer	μm	±50
Waxtarka Hal-Wafer	min/wafer	8
Waxtarka Multi-Wafer		Ilaa 4 xabbo oo xabbo oo xabbo ah ayaa isku mar la farsameeyey
Miisaanka Qalabka	kg	≈3,200
Cabirka Qalabka (W×D×H)	mm	2,730 × 1,550 × 2,070

Mabaadi'da Hawlgelinta

Nidaamku wuxuu ku gaaraa waxqabad gooyn gaar ah isagoo adeegsanaya tignoolajiyadan asaasiga ah:

1.Nidaamka Xakamaynta Dhaqdhaqaaqa Intelligent:
Matoorka toosan ee saxda ah ee saxda ah (ku celi saxnaanta meelaynta: ± 0.5μm)
· Kontoroolka isku-dhafka ah ee lix-dhidib ah oo taageeraya qorshaynta jihada adag
· algorithms-xakamaynta gariir-waqtiga-dhabta ah ee hubinta goynta xasilloonida

2.Nidaamka ogaanshaha Sare:
Dareemka dhererka laysarka 3D ee isku dhafan (sax: 0.1μm)
Meelaynta muuqaalka ee CCD oo heer sare ah (5 megapixels)
Module kormeerka tayada onlaynka ah

3. Habka Atoomatiga buuxa
Soo dejinta/dejinta tooska ah
· Nidaamka kala soocida caqliga
Unug nadiifin ah oo xiran (nadiif: Fasalka 10)

Codsiyada caadiga ah

Qalabkani wuxuu keenaa qiimo la taaban karo dhammaan codsiyada wax soo saarka semiconductor:

Goobta Codsiga	Qalabka Habka	Faa'iidooyinka Farsamada
Wax-soo-saarka IC	8/12 "Silicon Wafers	Waxay kordhisaa toosinta lithography
Qalabka Korontada	SiC/GaN Wafers	Waxay ka hortagtaa cilladaha geesaha
Dareemayaasha MEMS	SOI Wafers	Waxay xaqiijisaa isku halaynta aaladda
Qalabka RF	GaAs Wafers	Waxay hagaajisaa waxqabadka soo noqnoqda sare
Baakadaha horumarsan	Wafers dib loo dhisay	Waxay kordhisaa wax soo saarka baakadaha

Astaamaha

1.Four-station qaabeynta ee hufnaanta processing sare;
2. dejintii giraanta TAIKO iyo ka saarida
3. Waafaqsanaanta sare ee alaabta muhiimka ah;
4.Multi-dhidibka synchronous tiknoolijiyada gooynta waxay hubisaa goynta cidhifyada saxda ah;
5. Socodka habsocodka otomaatiga buuxa wuxuu si weyn u yareeyaa kharashka shaqada;
6.Customized worktable design awood processing deggan ee qaab-dhismeedka gaarka ah;

Hawlaha

1. Nidaamka ogaanshaha giraanta-dhibcaha;
2. Nadiifinta miiska shaqada ee otomaatiga ah;
3.Intelligent UV-debonding system;
4.Operation log duubo;
5. Isdhexgalka moduleka Automation Factory;

Ballanqaadka Adeegga

XKH waxay bixisaa adeegyo dhammaystiran, taageero nololeed oo buuxa oo loogu talagalay in lagu kordhiyo waxqabadka qalabka iyo hufnaanta hawlgelinta inta lagu jiro safarkaaga wax soo saarka.
1. Adeegyada Habaynta
Habaynta Qalab Habboon: Kooxdayada injineernimada waxay si dhow ula shaqeeyaan macaamiisha si ay u wanaajiyaan cabbirrada nidaamka (xawaaraha jarista, xulashada daab, iwm.) oo ku saleysan sifooyinka walxaha gaarka ah (Si/SiC/GaAs) iyo shuruudaha nidaamka.
Taageerada Horumarinta Geedi socodka: Waxaan bixinaa habayn muunad oo ay ku jiraan warbixino falanqayn oo faahfaahsan oo ay ku jiraan cabbiraadda qallafsanaanta iyo khariidaynta cilladaha.
Horumarinta Wax-soo-saarka: Qalabka cusub (tusaale, Ga₂O₃), waxaanu ku shuraakoobaynaa hormoodka wax-soo-saarayaasha la isticmaalo si aan u soo saarno arjiyada gaarka ah/laser optics.

2. Taageerada Farsamada Xirfadlayaasha
Taageerada Goobta ee Go'an: U qoondee injineero shahaado haysta oo ah marxaladaha kor u kaca ee muhiimka ah (sida caadiga ah 2-4 toddobaad), oo daboolaya:
Qalabaynta iyo habaynta habaynta qalabka
Tababarka aqoonta hawl-wadeenka
Tilmaamaha is dhexgalka qolka nadiifka ah ee ISO Class 5
Dayactirka saadaalinta ah: hubinta caafimaadka ee rubuc-biloodlaha ah oo leh falanqaynta gariirka iyo baadhitaanada servo motor si looga hortago wakhtiga hoos u dhaca ee aan la qorshayn.
Korjoogteynta fog: La socoshada waxqabadka qalabka-waqtiga-dhabta ah iyada oo loo marayo madal-keena IoT (JCFront Connect®) oo leh digniino toos ah.

3. Adeegyada qiimaha lagu daray
Saldhig Aqooneedka Habka: Helitaanka 300+ cuntooyin goyn ah oo ansax ah oo agabyo kala duwan ah (la cusbooneysiiyay saddexdii biloodba mar).
Tignoolajiyada Roadmap-ka toosinta: Mustaqbalka ku cadeeya maalgashigaaga dariiqyada cusboonaysiinta hardware/software (tusaale, cutubka ogaanshaha cilladaha ku salaysan AI).
Jawaabta Degdegga ah: Xaqiijin 4-saac oo ogaanshaha fogaanta ah iyo 48-saac faragelinta goobta (daboolanka caalamiga ah).

4. Kaabayaasha Adeegga
Dammaanadda Waxqabadka: Ballanqaadka qandaraaska ee ≥98% waqtiga qalabka oo leh waqtiyada jawaabta SLA ay taageerto.

Horumar joogto ah

Waxaan sameynaa sahan ku qanacsanaanta macaamiisha sannadkiiba mar waxaanan hirgelinaa dadaallada Kaizen si kor loogu qaado bixinta adeegga. Kooxdayada R&D waxay u tarjumaan aragtida goobta cusboonaysiinta qalabka - 30% hagaajinta firmware-ka waxay ka yimaadaan jawaab celinta macmiilka.