12inch Si Toos ah Si Toos ah u Goonaya Qalabka Lagu Arkay Qalabka Waferka ee Nidaamka Goynta Goynta ee Si/SiC & HBM (Al)
Xuduudaha farsamada
Halbeegga | Tilmaamid |
Cabbirka Shaqada | Φ8", Φ12" |
Spinal | dhidibka laba-geesoodka ah 1.2/1.8/2.4/3.0, ugu badnaan 60000 rpm |
Cabbirka daabka | 2" ~ 3" |
Y1 / Y2 dhidibka
| Kordhinta hal-tallaabo: 0.0001 mm |
Saxnaanta meelaynta: <0.002 mm | |
Qiyaasta goynta: 310 mm | |
X dhidibka | Xawaaraha quudinta: 0.1-600 mm/s |
dhidibka Z1/Z2
| Kordhinta hal-tallaabo: 0.0001 mm |
Saxnaanta meelaynta: ≤ 0.001 mm | |
θ dhidibka | Saxnaanta meelaynta: ± 15" |
Saldhiga Nadiifinta
| Xawaaraha wareeg: 100-3000 rpm |
Habka nadiifinta: Si toos ah u biyo raaci oo qallaji | |
Ku shaqaynta Voltage | 3-waji 380V 50Hz |
Cabirka (W×D×H) | 1550×1255×1880 mm |
Miisaanka | 2100 kg |
Mabda'a Shaqada
Qalabku wuxuu ku gaaraa goynta saxda ah ee saxda ah iyadoo loo marayo tignoolajiyada soo socda:
1.High-Rigidity Spindle System: Xawaaraha wareega ilaa 60,000 RPM, oo ku qalabaysan garbaha dheeman ama madax goynta laser si ay ula qabsadaan sifooyinka kala duwan.
2.Multi-Axis Motion Control: X / Y / Z-axis meelaynta saxnaanta ee ± 1μm, oo lagu dhejiyay miisaan sare oo sax ah si loo hubiyo waddooyinka goynta-free leexashada.
3.Intelligent Visual alignment: CCD-xalinta sare (5 megapixels) waxay si toos ah u aqoonsatey jarista waddooyinka waxayna magdhoweysaa is-diridda walxaha ama is-qabsiga.
4.Qaboojinta & Boodhka Ka Saaridda: Isku-dhafan nidaamka qaboojinta biyaha saafiga ah iyo soo saarista boodhka nuugista si loo yareeyo saamaynta kulaylka iyo wasakhowga walxaha.
Hababka Goynta
1.Blade Dicing: Ku haboon qalabka semiconductor-dhaqameedka sida Si iyo GaAs, oo leh ballacyada kerf ee 50-100μm.
2.Stealth Laser Dicing: Waxaa loo isticmaalaa waferrada aadka u dhuuban (<100μm) ama walxo jilicsan (tusaale, LT/LN), taas oo awood u siinaysa kala soocida walaaca.
Codsiyada caadiga ah
Qalab ku habboon | Goobta Codsiga | Shuruudaha Habaynta |
Silikoon (Si) | ICs, dareemayaasha MEMS | Goynta saxda ah ee sare, jajabinta <10μm |
Silicon Carbide (SiC) | Qalabka korontada (MOSFET/diodes) | Goynta waxyeelada hoose, hagaajinta maaraynta kulaylka |
Gallium Arsenide (GaAs) | Qalabka RF, chips optoelectronic | Ka hortagga dildilaaca-yar, xakamaynta nadaafadda |
Substrates LT/LN | filtarrada SAW, modulators indhaha | Goynta aan cadaadis lahayn, ilaalinta guryaha piezoelectric |
Substrate-ka dhoobada | Qaybaha tamarta, baakadaha LED | Qalabaynta walaxda adkeysigeedu sarreeyo, fidsanaanta geesaha |
Qaababka QFN/DFN | Baakadaha horumarsan | Multi-chip goynta isku mar ah, hufnaanta hufnaan |
WLCSP Wafers | Baakadaha heerka wafer | Goosha aan waxyeello lahayn ee maraqyada aadka u dhuuban (50μm) |
Faa'iidooyinka
1. Sawirka sawir-gacmeedka xawaaraha-sareya ee leh alaarmiga ka-hortagga isku dhaca, meelaynta degdegga ah, iyo kartida sixitaanka khaladka xooggan.
2. Habka goynta labada-spindle ee la wanaajiyey, hagaajinta waxtarka qiyaastii 80% marka la barbar dhigo nidaamyada hal-dhabar-dhabarka ah.
3. Kubbada si sax ah loo soo dejiyay, hagitaan toosan, iyo dhidibka Y-dhidibka kontoroolka xiran, hubinta xasiloonida mudada dheer ee mashiinada saxda ah.
4. Soo dejinta/dejinta si toos ah oo toos ah, meelaynta wareejinta, goynta toosinta, iyo kormeerka kerf, taas oo si weyn u yaraynaysa hawl-wadeenka (OP) culayska shaqada.
5.Gantry-style qaab-dhismeedka dhejinta dunta dunta, oo leh ugu yaraan kala dheerayn laba-blade ah oo ah 24mm, taas oo awood u siinaysa laqabsiga ballaaran ee hababka goynta-laba-spindle.
Astaamaha
1.Saaxsanaanta sare ee cabbirka dhererka aan xidhiidhka lahayn.
2.Wafer badan oo laba-blade ah oo goynta hal saxan ah.
3.Automatic calibration, kormeerka kerf, iyo hababka ogaanshaha jabinta daabka.
4.Waxay taageertaa habab kala duwan oo leh algorithms toosinta tooska ah ee la dooran karo.
5.Fault is- sixid functionality iyo-waqtiga dhabta ah kormeerka boosaska badan.
6.First-cut kartida kormeerka ka dib laajinta bilowga ah.
7.Customizable modules automation warshad iyo hawlo kale oo ikhtiyaari ah.
Adeegyada Qalabka
Waxaanu bixinaa taageero dhamaystiran laga bilaabo xulashada qalabka ilaa dayactirka muddada dheer:
(1) Horumarin gaar ah
Waxay ku taliyaan xalalka goynta daab/laysarka oo ku salaysan sifooyinka walxaha (tusaale, SiC engegnaanta, GaAs jajabnaanta).
Bixi tijaabada muunada bilaashka ah si loo xaqiijiyo tayada goynta (oo ay ku jiraan jajabinta, ballaca kerf, qallafsanaanta dusha, iwm.).
(2) Tababarka Farsamada
Tababarka aasaasiga ah: Hawlgalka qalabka, hagaajinta cabbirka, dayactirka joogtada ah.
Koorsooyin horumarsan: Hannaan hagaajinta agabka kakan (tusaale, goynta aan culayska lahayn ee substrates LT).
(3) Taageerada Iibka Kadib
· 24/7 Jawaab: Baadhitaanno fog ama caawimo goobta ah.
• Qaybaha hadhaaga ah: Suunka, daabadaha, iyo qaybaha indhaha si degdeg ah loogu beddelo.
Dayactirka ka hortagga ah: Isku-habaynta joogtada ah si loo ilaaliyo saxnaanta loona kordhiyo nolosha adeegga.

Faa'iidooyinkayaga
✔ Khibrada Warshadaha: U adeegida 300+ semiconductor caalami ah iyo soosaarayaasha elektiroonigga ah.
✔ Tiknoolajiyada Goynta-Dhaqanka: Tilmaamaha toosan ee saxda ah iyo nidaamyada servo waxay xaqiijinayaan xasilloonida hogaaminta warshadaha.
✔ Shabakadda Adeegga Caalamiga ah: Daboolista Aasiya, Yurub, iyo Waqooyiga Ameerika ee taageerada gudaha ah.
Baaritaanka ama weydiimaha, nala soo xiriir!

