Substrate Silicon-on-Insulator Substrate SOI wafer saddex lakab oo ah Microelectronics iyo Soo noqnoqoshada Raadiyaha
Soo bandhigida sanduuqa waferka
Soo bandhigida waferkayaga Silicon-On-Insulator (SOI), oo si taxadar leh loo farsameeyay oo leh saddex lakab oo kala duwan, wax ka beddelaya microelectronics iyo codsiyada inta jeer ee raadiyaha (RF). Substrate-kan cusubi waxa uu isku daraa lakabka silikoon ee sare, lakab oksaydh ah oo dahaaran, iyo substrate silikoon hoose si uu u bixiyo wax qabad iyo kala duwanaansho aan la qiyaasi karin.
Naqshadeynta baahida microelectronics casriga ah, waferkayaga SOI wuxuu bixiyaa aasaas adag oo loogu talagalay abuurista wareegyada isku dhafan ee adag (ICs) oo leh xawaare sare, hufnaan koronto, iyo isku halleyn. Lakabka silikoon ee ugu sarreeya wuxuu awood u siinayaa is-dhexgalka aan kala go 'lahayn ee qaybaha elektaroonigga ah ee adag, halka lakabka oksaydhka dahaadhka ah uu yareeyo awoodda dulin, kor u qaadida waxqabadka guud ee qalabka.
Dhanka codsiyada RF, waferkayaga SOI wuxuu ka sarreeyaa awooddiisa dulin hooseeya, koronto burbursan, iyo sifooyin gooni-gooni ah oo aad u wanaagsan. Ku habboon furayaasha RF, amplifiers, filtarrada, iyo qaybaha kale ee RF, substrate-kani wuxuu hubinayaa waxqabadka ugu wanaagsan ee nidaamyada isgaarsiinta wireless, nidaamyada radar, iyo in ka badan.
Intaa waxaa dheer, dulqaadka shucaaca ee dabiiciga ah ee waferka SOI wuxuu ka dhigayaa mid ku habboon hawada hawada iyo codsiyada difaaca, halkaasoo isku halaynta jawiga adag ay muhiim tahay. Dhismaheeda adag iyo sifada waxqabadka gaarka ah waxay dammaanad qaadayaan hawlgal joogto ah xitaa marka lagu jiro xaalado aad u daran.
Astaamaha Muhiimka ah:
Dhismaha Saddex-Lakab: Lakabka Silikon ee ugu sarreeya, lakabka oksaydhka dahaaran, iyo substrate silikoon hoose.
Waxqabadka Sare ee Microelectronics: Waxay sahlaysa samaynta IC-yada horumarsan ee leh xawaaraha iyo hufnaanta awoodda.
Waxqabadka RF heer sare ah: Awood yar oo dulin ah, danab burbursan oo sarreeya, iyo guryaha go'doominta sare ee aaladaha RF.
Isku hallaynta-Aerospace-Fasalka: U-dulqaadashada shucaaca ee dabiiciga ah waxay hubisaa isku halaynta deegaanka adag.
Codsiyada Kala Duwan: Waxay ku habboon yihiin warshado badan oo kala duwan, oo ay ku jiraan isgaarsiinta, hawada sare, difaaca, iyo kuwo kale.
Khibrad u yeelo jiilka soo socda ee microelectronics iyo tignoolajiyada RF adigoo isticmaalaya waferkayaga Silicon-On-Insulator (SOI) ee horumarsan. Furo fursado cusub oo hal-abuurnimo oo ku wad horumarka codsiyadaada adigoo isticmaalaya xalka substrate-ka gees-goyn.