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Mashiinka Goynta Dheemanka ee Multi-Wire ee loogu talagalay Qalabka Qallalan ee SiC Sapphire

Mashiinka Goynta Dheemanka ee SiC ee loogu talagalay Qalabka Jaban ee Aad u Adag ee SiC Sawirka La Soo Bandhigay
  • Mashiinka Goynta Dheemanka ee Multi-Wire ee loogu talagalay Qalabka Qallalan ee SiC Sapphire
  • Mashiinka Goynta Dheemanka ee Multi-Wire ee loogu talagalay Qalabka Qallalan ee SiC Sapphire
  • Mashiinka Goynta Dheemanka ee Multi-Wire ee loogu talagalay Qalabka Qallalan ee SiC Sapphire

Sharaxaad Gaaban:

Mashiinka jarista dheemanka ee silig badan leh waa nidaam jaris casri ah oo loogu talagalay in lagu farsameeyo agab aad u adag oo jilicsan. Iyadoo la adeegsanayo fiilooyin badan oo dheeman lagu dahaadhay, mashiinku wuxuu isku mar jari karaa wafer badan hal wareeg, isagoo gaaraya labadaba wax soo saar sare iyo saxnaan.


Astaamaha

Hordhac ku saabsan Mashiinka Jarjarka Dheemanka ee Multi-Wire

Mashiinka jarista dheemanka ee silig badan leh waa nidaam jaris casri ah oo loogu talagalay in lagu farsameeyo agab aad u adag oo jilicsan. Iyadoo la adeegsanayo fiilooyin badan oo dheeman ah oo is barbar socda, mashiinku wuxuu isku mar jari karaa wafer badan hal wareeg, isagoo gaaraya labadaba wax soo saar sare iyo saxnaan. Tiknoolajiyaddani waxay noqotay qalab muhiim ah warshadaha sida semiconductors, photovoltaics-ka qorraxda, LEDs, iyo dhoobada horumarsan, gaar ahaan agabka sida SiC, sapphire, GaN, quartz, iyo alumina.

Marka la barbardhigo jarista caadiga ah ee hal-silig, qaab-dhismeedka fiilooyinka badan wuxuu keenaa tobanaan ilaa boqolaal xaleef dufcaddiiba, taasoo si weyn u yareyneysa waqtiga wareegga iyadoo ilaalinaysa fidsanaan aad u fiican (Ra < 0.5 μm) iyo saxnaanta cabbirka (± 0.02 mm). Naqshadeeda qaabaysan waxay isku daraysaa xiisadda siligga otomaatiga ah, nidaamyada maaraynta shaqada, iyo la socodka khadka tooska ah, taasoo hubinaysa wax soo saar muddo dheer ah, deggan, iyo mid otomaatig ah oo dhammaystiran.

Halbeegyada Farsamada ee Mashiinka Jarjaridda Dheemanka ee Multi-Wire

Shay Faahfaahinta Shay Faahfaahinta
Cabbirka ugu badan ee shaqada (Laba jibaaran) 220 × 200 × 350 mm Matoorka wadista 17.8 kW × 2
Cabbirka ugu badan ee shaqada (Goobo) Φ205 × 350 mm Matoorka wadista silig 11.86 kW × 2
Kala fogaanshaha isbaarada Φ250 ±10 × 370 × 2 dhidib (mm) Matoorka kor u qaadista shaqada 2.42 kW × 1
dhidibka ugu muhiimsan 650 mm Matoorka leexashada 0.8 kW × 1
Xawaaraha orodka siligga 1500 m/daqiiqo Matoorka habaynta 0.45 kW × 2
Dhexroorka siliggu Φ0.12–0.25 mm Matoorka xiisadda 4.15 kW × 2
Xawaaraha kor u qaadista 225 mm/daqiiqo Matoorka slurry 7.5 kW × 1
Wareegga ugu badan ee miiska ±12° Awoodda taangiga slurry 300 L
Xagasha leexashada ±3° Socodka qaboojiyaha 200 L/daqiiqo
Soo noqnoqoshada ruxitaanka ~30 jeer/daqiiqad Saxnaanta heerkulka ±2 °C
Heerka quudinta 0.01–9.99 mm/daqiiqo Koronto la'aan 335+210 (mm²)
Heerka quudinta siligga 0.01–300 mm/daqiiqo Hawada la cadaadiyay 0.4–0.6 MPa
Cabbirka mashiinka 3550 × 2200 × 3000 mm Miisaanka 13,500 kg

Habka Shaqada ee Mashiinka Goynta Dheemanka ee Multi-Wire

  1. Dhaqdhaqaaqa Jarida Fiilada Badan
    Fiilooyin badan oo dheeman ah ayaa ku socda xawaare isku mid ah ilaa 1500 m/daqiiqo. Pulleys-ka si sax ah loo hago iyo xakamaynta xiisadda wareegga xiran (15–130 N) waxay fiilooyinka ka dhigaan kuwo deggan, taasoo yaraynaysa fursadda leexashada ama jabitaanka.

  2. Quudinta Saxda ah iyo Meelaynta
    Meelaynta ku-shaqaynta ee servo-ku-shaqayso waxay gaartaa saxnaan ±0.005 mm. Isku-dubaridka laysarka ikhtiyaariga ah ama is-waafajinta aragga ayaa xoojisa natiijooyinka qaababka adag.

  3. Qaboojinta iyo Ka saarista Qashinka
    Qaboojiyaha cadaadiska sare leh wuxuu si joogto ah uga saaraa jajabyada wuxuuna qaboojiyaa aagga shaqada, isagoo ka hortagaya waxyeelada kulaylka. Shaandhaynta marxalado badan leh waxay dheereysaa cimriga qaboojiyaha waxayna yareysaa waqtiga shaqada oo yaraada.

  4. Madal Xakamaynta Caqliga leh
    Darawalada servo-ka ee jawaabta sare leh (<1 ms) waxay si firfircoon u hagaajiyaan quudinta, xiisadda, iyo xawaaraha siligga. Maareynta cuntada ee isku dhafan iyo beddelka hal-guji ayaa fududeeya wax soo saarka tirada.

Faa'iidooyinka Muhiimka ah ee Mashiinka Jarjaridda Dheemanka ee Multi-Wire

  • Wax soo saar Sare
    Awood u leh inuu jaro 50–200 wafers halkii orod, iyadoo luminta kerf ay ka yar tahay 100 μm, taasoo hagaajinaysa isticmaalka agabka ilaa 40%. Wax soo saarku waa 5–10× kan nidaamyada silig-hal-dhaqameedka.

  • Xakamaynta Saxda ah
    Xasiloonida xiisadda siligga ee gudaha ±0.5 N waxay hubineysaa natiijooyin joogto ah oo ku saabsan agabyo kala duwan oo jajaban. La socodka waqtiga-dhabta ah ee ku saabsan is-dhexgalka 10" HMI wuxuu taageeraa kaydinta cuntada iyo hawlgalka fog.

  • Dhisme Dabacsan, Qaybsan
    Waxay la jaanqaadaysaa dhexroorka siligga laga bilaabo 0.12–0.45 mm hababka kala duwan ee jarista. Maareynta robot-ka ee ikhtiyaariga ah waxay u oggolaanaysaa khadadka wax soo saarka si buuxda oo otomaatig ah.

  • Kalsoonida Heerka Warshadaha
    Qaababka la shubay/la farsameeyay ee culus ayaa yareeya isbeddelka (<0.01 mm). Qalabka hagaha ee leh dahaarka dhoobada ama carbide waxay bixiyaan in ka badan 8000 saacadood oo cimri adeeg ah.

Nidaamka Goynta Dheemanka ee SiC ee Qalabka Jaban ee Aad u Adag 2

Beeraha Codsiga ee Mashiinka Jarjarka Dheemanka ee Multi-Wire

  • Kondhisoorrada Semiconductors: Jarista SiC ee loogu talagalay modules-ka awoodda EV, substrates-ka GaN ee aaladaha 5G.

  • Foornooyinka: Jarista wafer silicon ah oo xawaare sare leh oo leh ±10 μm isku mid ah.

  • LED & Optics: Substrates-ka safayr ee walxaha indhaha ee epitaxy iyo saxnaanta leh ee jajabka geesaha ka yar 20 μm.

  • Dhoobada Sare: Habaynta alumina, AlN, iyo agab la mid ah oo loogu talagalay qaybaha maaraynta hawada iyo kulaylka.

Nidaamka Goynta Dheemanka ee SiC ee SiC Sapphire Qalabka Jaban ee Aad u Adag 3

 

Nidaamka Goynta Dheemanka ee SiC ee Qalabka Jaban ee Aad u Adag 5

Nidaamka Goynta Dheemanka ee SiC ee SiC Sapphire Qalabka Jaban ee Aad u Adag 6

Su'aalaha Badiya La Weydiiyo - Mashiinka Jarjaridda Dheemanka ee Multi-Wire

S1: Waa maxay faa'iidooyinka jarista fiilooyinka badan marka loo eego mashiinnada fiilooyinka hal-halka ah?
A: Nidaamyada fiilooyinka badan leh waxay isku mar jari karaan daraasiin ilaa boqolaal wafer ah, taasoo kor u qaadaysa hufnaanta 5–10×. Isticmaalka agabka ayaa sidoo kale ka sarreeya iyadoo luminta kerf ay ka hooseyso 100 μm, taasoo ka dhigaysa mid ku habboon wax soo saarka ballaaran.

S2: Noocyo noocee ah ayaa laga farsameyn karaa?
J: Mashiinka waxaa loogu talagalay walxaha adag iyo kuwa jilicsan, oo ay ku jiraan silicon carbide (SiC), safayr, gallium nitride (GaN), quartz, alumina (Al₂O₃), iyo aluminium nitride (AlN).

S3: Waa maxay saxnaanta la gaari karo iyo tayada dusha sare?
A: Qalafsanaanta dusha sare waxay gaari kartaa Ra <0.5 μm, iyadoo saxnaanta cabbirka ay tahay ±0.02 mm. Jarista geesaha waxaa lagu xakameyn karaa <20 μm, iyadoo la buuxinayo heerarka warshadaha semiconductor iyo optoelectronic.

S4: Habka jarista ma keenaa dildilaac ama dhaawac?
A: Iyada oo la adeegsanayo qaboojiye cadaadis sare leh iyo xakamaynta xiisadda wareegga xiran, khatarta dildilaaca yar yar iyo dhaawaca cadaadiska ayaa la yareeyaa, taasoo hubinaysa hufnaanta wafer-ka ee aadka u fiican.

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