Mashiinka Jarida ee Diamond Wire Multi-Wire oo Xawaaraha Sare leh oo Sax ah oo Hoos u socda
Jaantus Faahfaahsan
Soo bandhig
Mashiinka jarista siligga dheemanka ah ee xawaaraha sare leh ee hoos u leexashada sare leh waa qalab CNC oo horumarsan oo loogu talagalay habaynta saxda ah ee walxaha adag iyo kuwa jilicsan. Waxay isku daraysaa teknoolojiyado badan oo casri ah, oo ay ku jiraan socodsiinta siligga xawaaraha sare leh, xakamaynta dhaqdhaqaaqa aadka u saxsan, jarista siligga isku mar ah ee badan, iyo jarista hoos u leexashada. Mashiinkani wuxuu gaaraa habaynta shaqada ee cabbirka weyn leh oo leh hufnaan heer sare ah iyo tayada dusha sare.
Iyadoo la adeegsanayo fiilada dheemanka ah sida habka jarista, mashiinku wuxuu bixiyaa iska caabin heer sare ah oo xirashada iyo saxnaanta jarista marka la barbar dhigo hababka jarista dhaqameed. Naqshadeeda fiilooyinka badan leh waxay suurtogal ka dhigaysaa jarista dufcadaha shaqada badan isku mar, taasoo si weyn u hagaajinaysa wax soo saarka iyadoo yareynaysa kharashyada wax soo saarka. Dhaqdhaqaaqa hoos u dhaadhaca wuxuu si siman u qaybiyaa awoodaha jarista, isagoo yareynaya cilladaha dusha sare iyo dildilaaca yaryar, taasoo keenta dusha sare ee la jaray oo siman oo nadiif ah.
Faa'iidooyinka Farsamada
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Jarid Xawaaraha Sare lehXawaaraha socodka siligga ilaa 2000 m/daqiiqad, taasoo si weyn hoos ugu dhigaysa waqtiga farsamaynta.
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Saxnaan Sare: Goynta saxnaanta ilaa 0.01 mm, hubinta isku dheelitirnaan dhumuc weyn iyo heerka wax soo saarka.
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Awood Fiilo Badan leh: Awoodda kaydinta siligga oo ah 20 km, oo taageerta jarista baaxadda weyn ee barbar socota.
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Goynta Lugaha: ±8° kala duwanaanshaha leexashada ee 0.83°/s si siman ayuu u qaybiyaa walbahaarka, wuxuu dheereeyaa cimriga siligga wuxuuna hagaajiyaa tayada dusha sare.
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Xakamaynta Xiisadda DabacsanJarista xiisadda laga bilaabo 10N ilaa 60N (kordhinta 0.1N), oo la qabsan kara agab kala duwan.
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Qaab-dhismeed AdagMiisaanka mashiinka oo ah 8000 kg wuxuu hubiyaa adkaansho sare iyo waxqabad xasilloon inta lagu jiro hawlgalka muddada dheer.
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Nidaamka Xakamaynta Caqliga leh: Is-dhexgal fudud oo leh dejinta halbeegga, kormeerka waqtiga-dhabta ah, iyo hawlaha digniinta cilladda.
Codsiyada Caadiga ah
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Warshadaha Foornada
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Goynta qaybaha silikoonka monocrystalline iyo polycrystalline
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Soo saarista wafers-ka qorraxda oo tayo sare leh
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Waxay wanaajisaa isticmaalka agabka waxayna yareysaa kharashyada habaynta
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Warshadaha Semiconductor-ka
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Goynta saxda ah ee SiC, GaAs, Ge, iyo wafersyada kale ee semiconductor-ka
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Goynta wafer-ka dhexroor weyn oo loogu talagalay sameynta jajabka
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Dammaanad qaadaya tayada dusha sare ee sare ee hababka semiconductor-ka ee dalbanaya
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Habaynta Agabka Cusub
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Goynta substrate-ka Sapphire ee LED-ka iyo qaybaha indhaha
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Goynta saxda ah ee kiristaalo macmal ah iyo walxaha magnetic
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Hagaajinta quartz, dhoobada galaaska, iyo agab kale oo adag
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Isticmaalka Cilmi-baarista & Shaybaarka
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Diyaarinta tusaalaha ah ee cilmi-baarista agabka cusub
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Tijaabooyin jaritaan sax ah oo heer sare ah oo yar yar
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Ansixinta habka lagu kalsoonaan karo ee codsiyada R&D
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Tilmaamaha Farsamada
| Halbeegga | Faahfaahinta |
| Mashruuc | Miinshaar silig oo badan oo leh miis shaqo oo dusha sare ah |
| Cabbirka ugu badan ee shaqada | ø 204 * 500mm |
| Dhexroorka dahaarka duubista ugu weyn (lagu go'ay labada darafba) | ø 240 * 510mm (laba duub oo waaweyn) |
| Xawaaraha orodka siligga | 2000 (Isku darka) m/daqiiqo |
| Dhexroorka silig dheeman ah | 0.1-0.5mm |
| Awoodda kaydinta khadka ee giraangiraha sahayda | 20 (0.25 Dhexroorka siligga dheemanka) km |
| Kala duwanaanshaha dhumucda jarista | 0.1-1.0mm |
| Saxnaanta jarista | 0.01mm |
| Hawlgalka kor u qaadista toosan ee goobta shaqada | 250mm |
| Habka jarista | Maaddadu way ruxmaysaa oo hoos uga soo degaysaa kor ilaa hoos, halka booska xariiqda dheemanku aanu isbeddelin. |
| Xawaaraha quudinta oo la jaray | 0.01-10mm/daqiiqo |
| Haanta biyaha | 300L |
| Dareeraha jarista | Dareeraha jarista waxtarka sare leh ee ka hortagga miridhku |
| Xawaaraha leexashada | 0.83°/s |
| Cadaadiska bamka hawada | 0.3-3MPa |
| Xagasha leexashada | ±8° |
| Xiisadda ugu badan ee goynta | 10N-60N (Deji cutubka ugu yar 0.1N) |
| Qoto dheer oo jarid ah | 500mm |
| Xarunta Shaqada | 1 |
| Koronto la'aan | Saddex-waji oo shan-fiilo ah AC380V/50Hz |
| Awoodda guud ee qalabka mashiinka | ≤92kW |
| Matoorka ugu weyn (qaboojinta wareegga biyaha) | 22*2kW |
| Matoorka fiilooyinka | 1 * 2kW |
| Mashiinka leexashada ee Workbench | 1.3*1kW |
| Matoorka xakamaynta xiisadda (qaboojinta wareegga biyaha) | 5.5*2kW |
| Matoorka sii deynta iyo ururinta siligga | 15*2kW |
| Cabbirrada dibadda (marka laga reebo sanduuqa gacanta ee rookaha) | 1320 * 2644 * 2840mm |
| Cabbirrada dibadda (oo ay ku jiraan sanduuqa gacanta ee dhagaxa) | 1780 * 2879 * 2840mm |
| Miisaanka mashiinka | 8000kg |
Su'aalaha Badiya La Weydiiyo
1. S: Waa maxay faa'iidada jarista gariirka ee miinshaarta siligga dheemanka?
A: Goynta oscillating (±8°) waxay yareysaa jajabka ilaa <15μm waxayna wanaajisaa dhammaystirka dusha sare (Ra<0.5μm) ee walxaha jilicsan sida SiC iyo safayr.
2. S: Sidee dhakhso ah ayay miinshaar dheeman oo badan oo silig leh u jari karaan wafers silicon ah?
J: Iyada oo leh 200+ fiilooyin xawaare dhan 1-3m/s, waxay jartaa 300mm wafers silicon ah wax ka yar 2 daqiiqo gudahood, taasoo kor u qaadaysa wax soo saarka 5x marka loo eego miinshaarta hal-silig leh.









