;Tusmada Buugga
1. Fikradaha Muhiimka ah iyo Halbeegyada
2. Farsamooyinka Cabbirka
3. Habaynta Xogta iyo Khaladaadka
4. Saamaynta Geedi socodka
Soo saarista semiconductor-ka, isku-midnaanta dhumucda iyo fidsanaanta dusha sare ee wafers-ka ayaa ah arrimo muhiim ah oo saameeya wax-soo-saarka habka. Xuduudaha muhiimka ah sida Kala-duwanaanshaha Dhumucda Guud (TTV), Bow (warpage arcuate), Warp (warpage caalami ah), iyo Microwarp (nano-topography) si toos ah ayay u saameeyaan saxnaanta iyo xasilloonida hababka asaasiga ah sida diiradda sawirka, nadiifinta farsamada kiimikada (CMP), iyo dhigista filimka khafiifka ah.
Fikradaha Muhiimka ah iyo Halbeegyada
TTV (Isbeddelka Guud ee Dhumucda)
TTV waxay tilmaamaysaa farqiga ugu badan ee dhumucda dusha sare ee wafer-ka oo dhan ee ku jira gobolka cabbiraadda ee la qeexay Ω (badanaa laga reebo aagagga ka-saarista geeska iyo gobollada u dhow meelaha ama dabaqyada). Xisaab ahaan, TTV = ugu badnaan(t(x,y)) - min(t(x,y)). Waxay diiradda saartaa isku-midnimada dhumucda gudaha ee substrate-ka wafer-ka, oo ka duwan qallafsanaanta dusha sare ama isku-midnimada filimka khafiifka ah.
Qaansada Qaansadu waxay qeexaysaa leexashada toosan ee barta dhexe ee wafer laga bilaabo meesha ugu yar ee loo qoondeeyay calaamadda tixraaca. Qiimaha togan ama taban waxay muujinayaan qalooca caalamiga ah ee kor u kaca ama hoos u dhaca.
Duub
Warp wuxuu cabbiraa farqiga ugu sarreeya ee u dhexeeya ugu sarreeya ilaa dooxooyinka dhammaan meelaha dusha sare marka loo eego diyaaradda tixraaca, isagoo qiimeynaya fidsanaanta guud ee wafer-ka ee xaalad xor ah.
Microwarp
Microwarp (ama nanotopography) wuxuu baaraa micro-undulation-ka dusha sare ee ku jira heerarka hirarka booska ee gaarka ah (tusaale ahaan, 0.5-20 mm). Iyadoo ay jiraan baaxado yar, kala duwanaanshahani si weyn ayuu u saameeyaa qoto dheer ee diiradda saarista (DOF) iyo isku mid ahaanshaha CMP.
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Qaab-dhismeedka Tixraaca Cabbirka
Dhammaan cabbirrada waxaa lagu xisaabiyaa iyadoo la adeegsanayo saldhig joomatari ah, caadi ahaan diyaarad ugu yaraan afargeesle ah (diyaaradda LSQ). Cabbiraadaha dhumucdoodu waxay u baahan yihiin iswaafajinta xogta dusha sare ee hore iyo gadaal iyada oo loo marayo geesaha wafer, godadka, ama calaamadaha iswaafajinta. Falanqaynta Microwarp waxay ku lug leedahay shaandhaynta booska si loo soo saaro qaybaha gaarka u ah hirarka.
Farsamooyinka Cabbirka
1. Hababka Cabbirka TTV
- Profilometry-ga Dual-Surface
- Interferometry-ga Fizeau:Wuxuu adeegsadaa cidhifyo faragelin ah oo u dhexeeya meel tixraac ah iyo dusha sare ee wafer-ka. Ku habboon dusha siman laakiin waxaa xaddidaya wafer-yada waaweyn ee qalooca leh.
- Interferometry-ga Iskaanka Iftiinka Cad (SWLI):Waxay cabbirtaa dhererka buuxa iyada oo loo marayo baqshadaha iftiinka ee isku xiran oo hooseeya. Wax ku ool ah dusha sare ee u eg tallaabooyinka laakiin waxaa xaddidaya xawaaraha sawir-qaadista farsamada.
- Hababka Isku-dhafka ah:Ku guuleyso xallinta sub-micron iyada oo loo marayo mabaadi'da godka biinka ama kala firdhinta. Ku habboon dusha sare ee qallafsan ama kuwa hufan laakiin gaabis ah sababtoo ah sawir-qaadista dhibic-dhibic.
- Saddex-xagalaynta laysarka:Jawaab degdeg ah laakiin u nugul luminta saxnaanta ka timaadda kala duwanaanshaha soo-iftiridda dusha sare.
- Isku xidhka Gudbinta/Milicsiga
- Dareemayaasha Awoodda Madaxa ee Labada-Madaxa: Meelaynta isku dheelitiran ee dareemayaasha labada dhinac waxay cabbirtaa dhumuc ahaan sida T = L - d₁ - d₂ (L = masaafada aasaasiga ah). Si dhakhso leh laakiin xasaasi u ah sifooyinka agabka.
- Ellipsometrium/Spectroscopic Reflectometry: Waxay falanqeysaa isdhexgalka walxaha iftiinka leh ee dhumucda filimada khafiifka ah laakiin aan ku habboonayn TTV-ga badan.
2. Cabbirka Qaansada iyo Wareegga
- Taxanaha Awoodda Baaritaanka Badan: Qabso xogta dhererka buuxa ee goobta oo ku taal marxalad hawo-qaadis ah si dib-u-dhis 3D ah oo degdeg ah loogu sameeyo.
- Saadaasha Iftiinka Qaabaysan: Qaabaynta 3D ee xawaaraha sare leh iyadoo la adeegsanayo qaabaynta indhaha.
- Interferometry-ga Hoose-NA: Khariidaynta dusha sare ee xallinta sare leh laakiin gariirka xasaasiga u ah.
3. Cabbirka Microwarp
- Falanqaynta Soo Noqnoqoshada Meelaha:
- Soo hel qaab-dhismeedka dusha sare ee xallinta sare leh.
- Xisaabi cufnaanta spectral-ka awoodda (PSD) iyada oo loo marayo 2D FFT.
- Ku mari shaandhada bandpass (tusaale ahaan, 0.5–20 mm) si aad u kala saarto hirarka muhiimka ah.
- Xisaabi qiimayaasha RMS ama PV xogta la sifeeyay.
- Jilitaanka Vacuum Chuck:Saamaynta isku-xidhka dhabta ah ee dunida dhabta ah inta lagu jiro lithography.
Hagaajinta Xogta iyo Ilaha Khaladaadka
Habaynta Shaqada
- TV-ga:Isku toosi isku-duwayaasha dusha sare ee hore/dambe, xisaabi farqiga dhumucda, oo kala jar khaladaadka nidaamsan (tusaale ahaan, kulaylka oo hoos u dhacaya).
- ;Qaanso/Warp:Ku habboon xogta diyaaradda LSQ ilaa dhererka; Qaansada = haraaga barta dhexe, Warp = haraaga ugu sarreeya ilaa dooxada.
- ;Microwave-ka:Shaandhee soo noqnoqoshada booska, xisaabi tirakoobka (RMS/PV).
Ilaha Khaladaadka Muhiimka ah
- Arrimaha Deegaanka:Gariir (muhiim u ah interferometry), jahwareerka hawada, kulaylka.
- Xaddidaadaha Dareemayaasha:Qaylada wejiga (interferometry), khaladaadka hagaajinta hirarka (confocal), jawaabaha ku xiran walxaha (awoodda).
- Maareynta Wafer-ka:Khalad ka saarista geeska, khaladaadka marxaladda dhaqdhaqaaqa ee tolida.
Saamaynta Muhiimka ah ee Habka
- Lithography:Microwarp-ka maxalliga ah wuxuu yareeyaa DOF, taasoo keenta kala duwanaansho CD iyo khaladaad dul saaran.
- CMP:Isku dheelitir la'aanta TTV-ga ee bilowga ah waxay keentaa cadaadis aan isku mid ahayn oo rinjiyeyn ah.
- Falanqaynta Walbahaarka:Horumarka qaanso/warp wuxuu muujinayaa dhaqanka cadaadiska kulaylka/farsamada.
- Baakadaha:TTV-ga xad-dhaafka ah wuxuu abuuraa faaruqyo ku jira isku-xidhka.
Wafer Sapphire ah oo XKH ah
Waqtiga boostada: Sebteembar-28-2025