Faa'iidooyinkaIyada oo loo marayo Glass Via (TGV)iyo Iyadoo loo marayo Silicon Via (TSV) hababka TGV inta badan waa:
(1) Sifooyin koronto oo aad u sarreeya. Maaddada muraayadda waa shey dahaarka, dielectric joogto ah waa kaliya oo ku saabsan 1/3 ee alaabta silikon, iyo qodobka khasaaraha waa 2-3 amarrada ka hooseeya kan walxaha silikoon, taas oo ka dhigaysa luminta substrate iyo saamaynta dulin si weyn loo dhimay oo hubinaysa daacadnimada calaamadda la kala qaado;
(2)cabbir weyn iyo substrate dhalo khafiif ahway fududahay in la helo. Corning, Asahi iyo SCHOTT iyo soosaarayaasha kale ee dhalooyinka waxay ku siin karaan cabbir aad u weyn (> 2m × 2m) iyo ultra- khafiif ah (<50µm) muraayadaha muraayadaha iyo aadka u dhuuban ee jilicsan.
3) Kharash yar. Ka faa'iidayso helitaanka fudud ee muraayadda muraayadda ultra-dhuuban ee cabbirka weyn, oo uma baahna dhigista lakabyada dahaarka, kharashka wax soo saarka ee saxanadda adabtarada galaaska waa kaliya 1/8 ee saxanka adabtarada ee silicon-ku salaysan;
4) Habka fudud. Looma baahna in lagu shubo lakabka dahaadhka ah ee dusha sare ee substrate iyo gidaarka gudaha ee TGV, wax khafiifin ah looma baahna saxanka adabtarada aadka u dhuuban;
(5) Deganaansho farsamo oo xooggan. Xataa marka dhumucda saxanka adabtarada uu ka yar yahay 100µm, wargeeska weli wuu yar yahay;
(6) Codsiyada ballaaran, waa tikniyoolajiyada isku-xirnaanta dheer ee soo ifbaxa ee lagu dabaqay duurka baakadaha heerka wafer, si loo gaaro masaafada ugu gaaban ee u dhaxaysa wafer-wafer, garoonka ugu yar ee isku xidhka ayaa bixiya dariiq teknoloji oo cusub, oo leh koronto heer sare ah, kuleyl, qalab farsamo, oo ku jira chip RF, dareemayaasha MEMS-dhamaadka sare, nidaamka cufnaanta sare leh ee is dhexgalka 6 G. Chip-frequency-sare 3D Waa mid ka mid ah xulashooyinka ugu horreeya ee baakadaha 3D ee jiilka soo socda ee 5G iyo 6G chips-soo noqnoqoshada sare.
Habka qaabaynta ee TGV inta badan waxaa ka mid ah ciid, daloolista ultrasonic, etching qoyan, falcelinta ion qoto dheer, etching sawir-qaadista, laser etching, xoqitaanka qoto-dheer ee leysarka, iyo diiradda saaridda samaynta daloolka dheecaanka.
Natiijooyinka cilmi-baadhista iyo horumarinta ee ugu dambeeyay waxay muujinayaan in tignoolajiyadu ay isku diyaarin karto iyada oo loo marayo godad iyo 5: 1 godad indhoolayaal ah oo qoto dheer ilaa ballaca 20: 1, oo leh qaab-dhismeedka wanaagsan. Laser-ku-jiidhiyaha qoto dheer, kaas oo keena qallafsanaan yar oo dusha sare ah, ayaa ah habka ugu badan ee hadda la baaray. Sida ku cad sawirka 1, waxaa jira dildilaacyo muuqda oo ku wareegsan qodista laysarka caadiga ah, halka gidaarada ku hareeraysan iyo gidaarada laysarka ee qotodheer ee ay keentay ay nadiif yihiin oo siman yihiin.
Habka processing eeTGVinterposer waxa lagu muujiyay sawirka 2. Qorshaha guud waa in marka hore godadka laga qodo substrate galaaska, ka dibna la dhigo lakabka xannibaadda iyo lakabka abuurka ee gidaarka iyo dusha sare. Lakabka xannibaadda ayaa ka hortagaya faafinta Cu ee substrate galaaska, iyada oo la kordhinayo adhesion ee labada, dabcan, daraasadaha qaarkood ayaa sidoo kale lagu ogaaday in lakabka xannibaadda aan loo baahnayn. Dabadeed Cu waxaa lagu shubaa koronto, ka dibna waa la tirtiraa, lakabka Cuna waxaa saaraya CMP. Ugu dambeyntiina, lakabka dib u habeynta RDL waxaa diyaariyey PVD daahan lithography, iyo lakabka passivation ayaa la sameeyaa ka dib marka xabagta la saaro.
(a) Diyaarinta wafer, (b) samaynta TGV, (c) korantada labajibaaran - dhigista naxaasta, (d) nuglaynta iyo CMP-dalaynta kiimikaad-farsamo, ka saarida lakabka naxaasta oogada, (e) daahan PVD iyo lithography, (f) meelaynta RDL rewiring lakabka, (g) Dejinta lakabka, (Cuvation) samaynta lakabka.
Isku soo wada duuboogalaaska dalool (TGV)Rajada codsigu waa mid ballaaran, suuqa gudaha ee hadda jirana wuxuu ku jiraa marxalad kor u kac ah, laga bilaabo qalabka ilaa naqshadeynta badeecada iyo cilmi baarista iyo heerka kobaca kobaca ayaa ka sarreeya celceliska adduunka.
Haddii uu jiro xad-gudub, la xiriir tirtir
Waqtiga boostada: Jul-16-2024