Nadiifinta qoyan (Nadiifinta qoyan) waa mid ka mid ah tallaabooyinka muhiimka ah ee hababka wax soo saarka semiconductor-ka, oo loogu talagalay in laga saaro wasakhda kala duwan ee dusha sare ee wafer-ka si loo hubiyo in tallaabooyinka geeddi-socodka ee xiga lagu samayn karo dusha nadiifka ah.
Maadaama cabbirka aaladaha semiconductor-ka uu sii yaraanayo oo shuruudaha saxnaanta ay sii kordhayaan, baahida farsamo ee hababka nadiifinta wafer-ka ayaa sii kordheysa. Xitaa walxaha ugu yar, walxaha dabiiciga ah, ion-yada birta ah, ama haraaga oksaydhka ee dusha sare ee wafer-ka ayaa si weyn u saameyn kara waxqabadka qalabka, taasoo saameyn ku yeelan karta wax soo saarka iyo kalsoonida aaladaha semiconductor-ka.
Mabaadi'da Aasaasiga ah ee Nadiifinta Wafer-ka
Xudunta nadiifinta waferku waxay ku jirtaa in si wax ku ool ah looga saaro wasakho kala duwan oo ka soo baxa dusha sare ee waferka iyada oo loo marayo habab jireed, kiimiko, iyo habab kale si loo hubiyo in waferku uu leeyahay dusha nadiif ah oo ku habboon farsamaynta dambe.
Nooca Wasakhowga
Saamaynta ugu Muhiimsan ee Astaamaha Qalabka
| Wasakhowga Qodobka | Cilladaha qaab-dhismeedka
Cilladaha ku-tallaalidda Ion-ka
Cilladaha burburka filimka dahaarka leh
| |
| Wasakhowga Birta | Biraha Alkali | Xasillooni la'aanta transistor-ka MOS
Burburka/burburka filimka oksaydhka albaabka
|
| Biraha Culus | Kororka qulqulka daadinta rogan ee isgoyska PN
Cilladaha burburka filimka oksaydhka albaabka
Hoos u dhaca cimriga ee qalabka qaada dadka laga tirada badan yahay
Soo saarista cilladda lakabka kicinta oksaydhka
| |
| Wasakhowga Kiimikada | Walxaha Dabiiciga ah | Cilladaha burburka filimka oksaydhka albaabka
Kala duwanaanshaha filimka CVD (waqtiyada ku-shubista)
Kala duwanaanshaha dhumucda filimka oksaydhka kulaylka (oksaydh degdeg ah)
Dhacdooyinka ceeryaamo (wafer, muraayad, muraayad, maaskaro, muraayad)
|
| Dopants aan dabiici ahayn (B, P) | Isbeddellada Vth transistor-ka MOS
Kala duwanaanshaha iska caabbinta poly-silicon ee substrate-ka iyo iska caabbinta sare ee substrate-ka
| |
| Saldhigyada aan dabiiciga ahayn (amines, ammonia) & asiidhyada (SOx) | Qasabka xallinta iska caabbinta kiimikada lagu xoojiyay
Soo ifbixidda wasakhowga walxaha iyo ceeryaamo ka dhalata soo saarista milixda
| |
| Filimada Oxide-ka ee Asalka ah iyo kuwa Kiimikada ah oo ay ugu wacan tahay Qoyaanka, Hawada | Kordhinta iska caabbinta xiriirka
Burburka/burburka filimka oksaydhka albaabka
| |
Gaar ahaan, ujeedooyinka habka nadiifinta wafer-ka waxaa ka mid ah:
Ka saarista walxaha: Adeegsiga hababka jireed ama kiimikada si looga saaro walxaha yaryar ee ku xiran dusha sare ee walxaha. Walxaha yaryar way adag tahay in laga saaro sababtoo ah xoogagga korantada ee xooggan ee u dhexeeya iyaga iyo dusha sare ee walxaha, taasoo u baahan daaweyn gaar ah.
Ka saarista Walxaha Dabiiciga ah: Wasakhda dabiiciga ah sida dufanka iyo haraaga photoresist-ka ayaa ku dhegi kara dusha sare ee wafer-ka. Wasakhdan waxaa caadi ahaan laga saaraa iyadoo la isticmaalayo walxo oksaydheyn ama dareereyaal xooggan.
Ka saarista Ion-ka Birta: Hadhaaga Ion-ka birta ee dusha sare ee wafer-ka ayaa hoos u dhigi kara waxqabadka korantada xitaa waxay saameyn kartaa tallaabooyinka farsamaynta ee xiga. Sidaa darteed, xalal kiimiko oo gaar ah ayaa loo isticmaalaa in lagu saaro Ion-yadan.
Ka saarista oksaydhka: Habab qaar ayaa u baahan in dusha sare ee wafer-ka ay ka xorowdo lakabyada oksaydhka, sida silicon oxide. Xaaladaha noocaas ah, lakabyada oksaydhka dabiiciga ah ayaa loo baahan yahay in laga saaro inta lagu jiro tallaabooyinka nadiifinta qaarkood.
Caqabadda tiknoolajiyada nadiifinta wafer-ka waxay ku jirtaa in si hufan looga saaro wasakhda iyada oo aan si xun u saameyn dusha sare ee wafer-ka, sida ka hortagga xoqidda dusha sare, daxalka, ama waxyeello kale oo jireed.
2. Socodka Habka Nadiifinta Wafer-ka
Habka nadiifinta wafer-ka badanaa wuxuu ku lug leeyahay tallaabooyin badan si loo hubiyo in si buuxda looga saaro wasakhda loona gaaro dusha sare oo nadiif ah.
Jaantuska: Isbarbardhigga Nadiifinta Nooca Dufcadda iyo Hal Wafer
Habka nadiifinta wafer-ka caadiga ah waxaa ka mid ah tallaabooyinka ugu muhiimsan ee soo socda:
1. Nadiifinta Hore (Nadiifinta Hore)
Ujeedada nadiifinta kahor waa in laga saaro wasakhda dabacsan iyo walxaha waaweyn ee dusha sare ee wafer-ka, kaas oo caadiyan lagu gaaro raacinta biyaha la baabi'iyay (DI Water) iyo nadiifinta ultrasonic-ka. Biyaha la baabi'iyay waxay marka hore ka saari karaan walxaha iyo wasakhda la milmay ee dusha sare ee wafer-ka, halka nadiifinta ultrasonic-ka ay isticmaasho saamaynta cavitation-ka si ay u jebiso xiriirka u dhexeeya walxaha iyo dusha sare ee wafer-ka, taasoo ka dhigaysa mid fudud in la kala saaro.
2. Nadiifinta Kiimikada
Nadiifinta kiimikada waa mid ka mid ah tallaabooyinka ugu muhiimsan ee habka nadiifinta wafer-ka, iyadoo la adeegsanayo xalal kiimiko ah si looga saaro walxaha dabiiciga ah, ion-yada birta ah, iyo oksaydhyada dusha sare ee wafer-ka.
Ka saarista Walxaha Dabiiciga ah: Caadi ahaan, acetone ama isku darka ammonia/peroksaydh (SC-1) ayaa loo isticmaalaa in lagu milmo oo lagu oksaydhiyo wasakhda dabiiciga ah. Saamiga caadiga ah ee xalka SC-1 waa NH₄OH
₂O₂
₂O = 1:1:5, oo leh heerkul shaqeynaya oo qiyaastii ah 20°C.
Ka saarista Ion-ka Birta: Isku darka nitric acid ama hydrochloric acid/peroksaydh (SC-2) ayaa loo isticmaalaa in lagu saaro aayada birta ah dusha sare ee wafer-ka. Saamiga caadiga ah ee xalka SC-2 waa HCl.
₂O₂
₂O = 1:1:6, iyadoo heerkulka lagu hayo qiyaastii 80°C.
Ka saarista oksaydhka: Habab qaar, waxaa loo baahan yahay in laga saaro lakabka oksaydhka asalka ah ee dusha sare ee wafer-ka, kaas oo loo isticmaalo xalka hydrofluoric acid (HF). Saamiga caadiga ah ee xalka HF waa HF.
₂O = 1:50, waxaana loo isticmaali karaa heerkulka qolka.
3. Nadiifintii Ugu Dambeysay
Ka dib nadiifinta kiimikada, buskudku badanaa waxay maraan tallaabo nadiifin ah oo kama dambays ah si loo hubiyo inaysan jirin haraaga kiimikada oo ku haray dusha sare. Nadiifinta kama dambaystu waxay inta badan isticmaashaa biyo la dhalaaliyay si loo sifeeyo si fiican. Intaa waxaa dheer, nadiifinta biyaha ozone (O₃/H₂O) ayaa loo isticmaalaa in si dheeraad ah looga saaro wasakhda ka hartay dusha sare ee buskudka.
4. Qallajinta
Waferada la nadiifiyey waa in si dhakhso ah loo qalajiyaa si looga hortago in biyaha wasakhaysan ay ku dhacaan ama ay dib ugu xirmaan wasakhda. Hababka caadiga ah ee lagu qalajiyo waxaa ka mid ah qalajinta wareegga iyo nadiifinta nitrogen-ka. Kan hore wuxuu qoyaanka ka saaraa dusha sare ee wafer-ka isagoo ku wareegaya xawaare sare, halka kan dambe uu hubinayo in si buuxda loo qalajiyo isagoo afuufaya gaaska nitrogen-ka qalalan ee dusha sare ee wafer-ka.
Wasakhaysan
Magaca Habka Nadiifinta
Sharaxaadda Isku-darka Kiimikada
Kiimikooyinka
| Walxaha | Piranha (SPM) | Aashitada Sulfuric/haydrojiin peroxide/biyo DI | H2SO4/H2O2/H2O 3-4:1; 90°C |
| SC-1 (APM) | Ammonium hydroxide/haydrojiin peroxide/DI biyo | NH4OH/H2O2/H2O 1:4:20; 80°C | |
| Biraha (ma aha naxaasta) | SC-2 (HPM) | Aashitada Haydroklorik/haydroj peroxide/DI biyo | HCl/H2O2/H2O1:1:6; 85°C |
| Piranha (SPM) | Aashitada Sulfuric/haydrojiin peroxide/biyo DI | H2SO4/H2O2/H2O3-4:1; 90°C | |
| DHF | Biyaha ku milmi aashitada hydrofluoric/DI (kama saari doonaan naxaasta) | HF/H2O1:50 | |
| Organics | Piranha (SPM) | Aashitada Sulfuric/haydrojiin peroxide/biyo DI | H2SO4/H2O2/H2O 3-4:1; 90°C |
| SC-1 (APM) | Ammonium hydroxide/haydrojiin peroxide/DI biyo | NH4OH/H2O2/H2O 1:4:20; 80°C | |
| DIO3 | Ozone-ka ku jira biyaha aan ionka lahayn | Isku-darka La Hagaajiyay ee O3/H2O | |
| Oksaydh-ka Asalka ah | DHF | Biyaha hydrofluoric/DI oo milma | HF/H2O 1:100 |
| BHF | Aashitada hydrofluoric ee la buufiyay | NH4F/HF/H2O |
3. Hababka Nadiifinta Wafer-ka Caadiga ah
1. Habka Nadiifinta RCA
Habka nadiifinta RCA waa mid ka mid ah farsamooyinka nadiifinta wafer-ka ugu caansan warshadaha semiconductor-ka, oo ay soo saartay RCA Corporation in ka badan 40 sano ka hor. Habkan waxaa ugu horreyn loo isticmaalaa in lagu saaro wasakhda dabiiciga ah iyo wasakhda birta ee ion-ka waxaana lagu dhammaystiri karaa laba tallaabo: SC-1 (Standard Clean 1) iyo SC-2 (Standard Clean 2).
Nadiifinta SC-1: Tallaabadan waxaa inta badan loo isticmaalaa in lagu saaro wasakhda iyo walxaha dabiiciga ah. Xalku waa isku darka ammonia, hydrogen peroxide, iyo biyo, kaas oo sameeya lakab khafiif ah oo silicon oxide ah oo ku yaal dusha sare ee wafer-ka.
Nadiifinta SC-2: Tallaabadan waxaa ugu horreyn loo isticmaalaa in lagu saaro wasakhda birta ee ion-ka, iyadoo la isticmaalayo isku darka aashitada hydrochloric, hydrogen peroxide, iyo biyaha. Waxay ka tagtaa lakab khafiif ah oo passivation ah dusha sare ee wafer-ka si looga hortago wasakhowga.
2. Habka Nadiifinta Piranha (Nadiifinta Piranha Etch)
Habka nadiifinta Piranha waa farsamo aad waxtar u leh oo lagu saarayo walxaha dabiiciga ah, iyadoo la adeegsanayo isku darka asiidhka sulfuric iyo hydrogen peroxide, oo caadi ahaan ah saamiga 3: 1 ama 4: 1. Sababtoo ah sifooyinka oksaydhka ee aadka u xooggan ee xalkan, wuxuu ka saari karaa xaddi badan oo walxo dabiici ah iyo wasakho adag. Habkani wuxuu u baahan yahay xakameyn adag oo xaaladaha ah, gaar ahaan marka la eego heerkulka iyo xoogga, si looga fogaado waxyeelada wafer-ka.
Nadiifinta Ultrasonic waxay isticmaashaa saameynta cavitation-ka ee ay keento hirarka dhawaaqa ee soo noqnoqda ee dareeraha ah si looga saaro wasakhda dusha sare ee wafer-ka. Marka la barbardhigo nadiifinta ultrasonic-ka ee dhaqameed, nadiifinta megasonic waxay ku shaqeysaa soo noqnoqosho sare, taasoo suurtogalinaysa in si hufan looga saaro walxaha cabbirka yar yar iyada oo aan waxyeello u geysan dusha wafer-ka.
4. Nadiifinta Ozone
Tiknoolajiyadda nadiifinta Ozone waxay isticmaashaa sifooyinka oksaydhaynta ee xooggan ee ozone-ka si ay u burburiso oo ay uga saarto wasakhda dabiiciga ah ee dusha sare ee wafer-ka, ugu dambayntiina waxay u beddelaan kaarboon laba ogsaydh iyo biyo aan waxyeello lahayn. Habkani uma baahna isticmaalka kiimikooyinka qaali ah wuxuuna keenaa wasakhowga deegaanka oo yar, taasoo ka dhigaysa tikniyoolajiyad soo ifbaxaysa oo ku saabsan nadiifinta wafer-ka.
4. Qalabka Nadiifinta Wafer-ka
Si loo hubiyo hufnaanta iyo badbaadada hababka nadiifinta wafer-ka, qalab nadiifin oo casri ah oo kala duwan ayaa loo isticmaalaa wax soo saarka semiconductor-ka. Noocyada ugu muhiimsan waxaa ka mid ah:
1. Qalabka Nadiifinta Qoyanka
Qalabka nadiifinta qoyan waxaa ka mid ah haamaha kala duwan ee lagu shubo biyaha, haamaha nadiifinta ultrasonic, iyo qalajiyeyaasha wareegga. Qalabkani wuxuu isku daraa awoodaha farsamada iyo walxaha kiimikada si looga saaro wasakhda dusha sare ee wafer-ka. Haamaha qubeyska waxaa badanaa lagu qalabeeyaa nidaamyada xakamaynta heerkulka si loo hubiyo xasilloonida iyo waxtarka xalalka kiimikada.
2. Qalabka Nadiifinta Qallalan
Qalabka nadiifinta qalalan waxaa inta badan ka mid ah nadiifiyeyaasha balaasmaha, kuwaas oo isticmaala walxo tamar sare leh oo ku jira balaasmaha si ay ula falgalaan ugana saaraan haraaga dusha sare ee wafer-ka. Nadiifinta balaasmaha ayaa si gaar ah ugu habboon hababka u baahan ilaalinta sharafta dusha sare iyada oo aan la soo gelin haraaga kiimikada.
3. Nidaamyada Nadiifinta ee Otomaatigga ah
Iyada oo si joogto ah loo ballaarinayo wax soo saarka semiconductor-ka, nidaamyada nadiifinta otomaatiga ah ayaa noqday doorashada ugu wanaagsan ee nadiifinta wafer-ka baaxadda weyn. Nidaamyadani waxay inta badan ku jiraan hababka wareejinta otomaatiga ah, nidaamyada nadiifinta taangiyada badan, iyo nidaamyada xakamaynta saxda ah si loo hubiyo natiijooyinka nadiifinta joogtada ah ee wafer kasta.
5. Isbeddellada Mustaqbalka
Maadaama aaladaha semiconductor-ka ay sii yaraanayaan, tiknoolajiyada nadiifinta wafer-ka ayaa u soo ifbaxaysa xalal waxtar leh oo deegaanka u fiican. Tiknoolajiyada nadiifinta ee mustaqbalka waxay diiradda saari doonaan:
Ka saarista walxaha yaryar ee nanometer-ka: Tiknoolajiyada nadiifinta ee jira waxay wax ka qaban kartaa walxaha yaryar ee nanometer-ka, laakiin iyadoo la dhimayo cabbirka qalabka, ka saarista walxaha yaryar ee nanometer-ka waxay noqon doontaa caqabad cusub.
Nadiifinta Cagaaran iyo Deegaanka u Fiican: Yaraynta isticmaalka kiimikooyinka deegaanka u waxyeeleeya iyo horumarinta hababka nadiifinta deegaanka u roon, sida nadiifinta ozone iyo nadiifinta megasonic, ayaa sii kordheysa muhiimaddeeda.
Heerarka Sare ee Otomaatigga iyo Sirdoonka: Nidaamyada caqliga leh waxay awood u siin doonaan la socodka waqtiga-dhabta ah iyo hagaajinta xuduudaha kala duwan inta lagu jiro habka nadiifinta, taasoo sii wanaajinaysa waxtarka nadiifinta iyo hufnaanta wax soo saarka.
Tiknoolajiyadda nadiifinta wafer-ka, oo ah tallaabo muhiim ah oo ku saabsan wax soo saarka semiconductor-ka, waxay door muhiim ah ka ciyaartaa hubinta dusha sare ee wafer-ka nadiifka ah ee hababka xiga. Isku-darka hababka kala duwan ee nadiifinta si wax ku ool ah ayay uga saartaa wasakhda, taasoo siinaysa dusha sare ee substrate-ka ah tallaabooyinka xiga. Marka tiknoolajiyadu horumarto, hababka nadiifinta ayaa sii wadi doona in la hagaajiyo si loo daboolo baahiyaha saxnaanta sare iyo heerarka cilladaha hoose ee wax soo saarka semiconductor-ka.
Waqtiga boostada: Oktoobar-08-2024