Mashiinka wax lagu dhogorta dheemanka-badan ee Wire-ka ah ee SiC Sapphire Ultra-Hard Brittle Materials
Hordhaca Mashiinka Wax-saarka Dheemanka-Multi-Wire
Mashiinka wax lagu jarjaro ee dheemanka ah ee silig badan leh waa hab casri ah oo wax lagu jarjaro oo loogu talagalay in lagu farsameeyo walxo aad u adag oo jilicsan. Iyadoo la geynayo fiilooyin badan oo isku mid ah oo dheeman-dahaar ah, mashiinku wuxuu isku mar gooyn karaa wafers badan oo hal wareeg ah, isagoo ku gaari kara saxnaanta sare iyo labadaba. Farsamadani waxay noqotay qalab lagama maarmaan u ah warshadaha sida semiconductors, photovoltaics qorraxda, LEDs, iyo ceramics horumarsan, gaar ahaan qalabka sida SiC, sapphire, GaN, quartz, iyo alumina.
Marka la barbar dhigo goynta hal silig ee caadiga ah, qaabeynta xargaha badan waxay keenaysaa daraasiin ilaa boqollaal xaleef dufcaddiiba, taasoo si weyn u yaraynaysa wakhtiga wareegga iyadoo la ilaalinayo fidsanaanta wanaagsan (Ra <0.5 μm) iyo saxnaanta cabbirka (± 0.02 mm). Naqshaddeeda modular-ka ah waxa ay midaysaa xiisadda siligga otomaatiga ah, hababka maaraynta shaqada, iyo la socodka internetka, hubinta wax-soo-saarka muddada-dheer, xasilloon, oo otomaatig ah.
Halbeegyada Farsamo ee Mashiinka Wax-saarka Dheemanka-Wire-ka Badan
| Shayga | Tilmaamid | Shayga | Tilmaamid |
|---|---|---|---|
| Cabbirka shaqada ee ugu badan (Square) | 220 × 200 × 350 mm | Matoorka wad | 17.8 kW × 2 |
| Cabbirka shaqada ugu badan (wareeg) | Φ205 × 350 mm | Matoorka wadida siliga | 11.86 kW × 2 |
| Kala dheeraynta lafdhabarta | Φ250 ± 10 × 370 × 2 dhidibka (mm) | Matoorka wiishka shaqada | 2.42 kW × 1 |
| dhidibka ugu muhiimsan | 650 mm | Matoorka lulida | 0.8 kW × 1 |
| Xawaaraha orodka fiilada | 1500 m/daqiiqo | Matoorka qabanqaabada | 0.45 kW × 2 |
| Dhexroorka siliga | Φ0.12-0.25 mm | Matoorka kacsanaanta | 4.15 kW × 2 |
| Xawaaraha kor u qaadista | 225 mm/min | Matoorka qulqulaya | 7.5 kW × 1 |
| Max. wareegga miiska | ±12° | Awoodda haanta slurry | 300 L |
| xagal lulid | ±3° | socodka qaboojiye | 200 L/daqiiqo |
| Inta jeer ee lulid | ~30 jeer/daqdi | Heerkulka saxsanaanta | ±2 °C |
| Heerka quudinta | 0.01-9.99 mm/min | Korontada | 335+210 (mm²) |
| Heerka quudinta fiilada | 0.01-300 mm/min | Hawo cufan | 0.4–0.6 MPa |
| Cabbirka mashiinka | 3550 × 2200 × 3000 mm | Miisaanka | 13,500 kg |
Farsamaynta Shaqada ee Mashiinka Wax-saarka Dheemanka-Wire-ka badan
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Dhaqdhaqaaq Goynta Silig Badan
Fiilooyin dheeman ah oo badan ayaa ku socda xawaare isku mid ah ilaa 1500 m/daqiiqo. Jeexitaanka saxda ah ee lagu hagayo iyo xakamaynta xiisadda xidhxidhan (15-130 N) waxay xajiyaan fiilooyinka kuwo xasiloon, yaraynta fursada leexashada ama jabinta. -
Quudinta Saxda ah & Meelaynta
Meelaynta uu wado Servo waxay gaadhay ± 0.005 mm saxnaanta. Laysarka Ikhtiyaarka ah ama toosinta aragga-caawintu waxay wanaajisaa natiijooyinka qaababka adag. -
Qaboojinta iyo saarista qashinka
Qaboojiyaha cadaadiska sarreeya wuxuu si joogto ah u saaraa jajabyada wuxuuna qaboojiyaa goobta shaqada, isagoo ka hortagaya waxyeellada kulaylka. Sifeynta marxaladaha badan waxay kordhisaa nolosha qaboojiye waxayna yaraynaysaa wakhtiga dhimista. -
Platform Control Smart
Darawalada servo-ga jawaabta sare ah (<1 ms) waxay si firfircoon u hagaajiyaan quudinta, kacsanaanta, iyo xawaaraha siliga. Maaraynta cunto karinta isku-dhafan iyo hal-guji halbeegga beddelka toosinta wax-soo-saarka tirada badan.
Faa'iidooyinka Muhiimka ah ee Mashiinka Wax-saarka Dheemman-Wire-ka Badan
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Wax soo saar sare
Awood u leh in la gooyo 50-200 wafers halkii orod, oo leh luminta kerf <100 μm, hagaajinta isticmaalka walxaha ilaa 40%. Wax-soo-saarku waa 5-10 × ka ah hababka caadiga ah ee siligga-hal-abuurka ah. -
Xakamaynta saxda ah
Dejinta xiisadda fiilada gudaha ± 0.5 N waxay hubisaa natiijooyin joogto ah oo ku saabsan walxo jajaban oo kala duwan. La socodka wakhtiga-dhabta ah ee 10 "HMI interface waxay taageertaa kaydinta cuntada iyo hawlgalka fog. -
Dabacsan, Dhismo Habboon
La jaan qaada dhexroorka fiilada laga bilaabo 0.12-0.45 mm ee hababka goynta kala duwan. Ikhtiyaarka ikhtiyaariga ah ee robotic-ku-hawlgalayaasha ayaa u oggolaanaya khadadka wax-soo-saarka si toos ah oo toos ah. -
Isku hallaynta Fasalka Warshadaha
Xirmooyinka culus ee kabka/looxyada been abuurka ah waxay yareeyaan qallafsanaanta (<0.01 mm). Jilbalooyinka haga ee leh dahaarka dhoobada ama karbiide waxay bixiyaan in ka badan 8000 saacadood oo nolol adeeg ah.
Goobaha Codsiga Mashiinka Wax-saarka Dheemanka-Multi-Wire
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SemiconductorsGoynta SiC ee qaybaha korantada ee EV, GaN substrates ee aaladaha 5G.
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Sawir-qaadista: Wafer silikoon xawaare sare leh oo la jarjaray oo leh ± 10 μm lebis.
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LED & Optics: Sapphire substrates ee epitaxy iyo walxaha indhaha ee saxda ah oo leh <20 μm gees gees ah.
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Ceramics horumarsan: Habaynta alumina, AlN, iyo agabka la midka ah ee hawada iyo qaybaha maamulka kulaylka.
FAQ - Multi-Wire Dheemanka dhogorta Machine
Q1: Maxay yihiin faa'iidooyinka fiilooyinka badan ee fiilooyinka marka la barbar dhigo mashiinnada hal-siliga ah?
J: Nidaamyada siligga badan ayaa isku mar jeexjeexi kara daraasiin ilaa boqollaal wafers, iyagoo kor u qaadaya waxtarka 5-10×. Ka faa'iidaysiga agabka ayaa sidoo kale ka sarreeya khasaaraha kerf ee ka hooseeya 100 μm, taas oo ka dhigaysa mid ku habboon wax soo saarka ballaaran.
Q2: Waa maxay noocyada agabka la farsamayn karaa?
A: Mashiinka waxaa loogu talagalay qalab adag oo jilicsan, oo ay ku jiraan silicon carbide (SiC), sapphire, gallium nitride (GaN), quartz, alumina (Al₂O₃), iyo aluminium nitride (AlN).
Q3: Waa maxay saxnaanta la gaari karo iyo tayada dusha sare?
J: Qalafsanaanta dusha sare waxay gaari kartaa Ra <0.5 μm, iyadoo saxnaanta cabbirkeedu yahay ± 0.02 mm. Chipping Edge waxaa lagu xakameyn karaa ilaa <20 μm, oo la kulma semiconductor iyo heerarka warshadaha indhaha.
Q4: Habka goynta miyuu keena dildilaac ama dhaawac?
J: Iyada oo qaboojiye-cadaadiska sareeyo iyo xakamaynta xiisadda-loop-ka-xiran, khatarta dildilaaca-yar-yar iyo dhaawaca walaaca waa la yareeyaa, iyada oo la hubinayo daacadnimada wafer-ga fiican.
