Qalabka tiknoolajiyada laysarka Microjet ee goynta wafer-ka SiC ee wax lagu karsado

Qalabka tiknoolajiyada laysarka Microjet ee jarista wafer-ka SiC ee wax lagu farsameeyo Sawirka Featured

Sharaxaad Gaaban:

Qalabka tignoolajiyada laysarka Microjet waa nooc ka mid ah nidaamka mashiinka saxda ah kaas oo isku daraya laysarka tamarta sare leh iyo jet dareere heer micron ah. Iyadoo la isku xirayo iftiinka laysarka iyo jet dareere xawaare sare leh (biyo la miiray ama dareere gaar ah), habaynta agabka oo leh saxnaan sare iyo waxyeello kuleyl oo hooseeya ayaa la xaqiijin karaa. Tiknoolajiyadani waxay si gaar ah ugu habboon tahay jarista, qodista iyo habaynta qaab-dhismeedka yar ee walxaha adag iyo kuwa jilicsan (sida SiC, safayr, galaas), waxaana si weyn loogu isticmaalaa semiconductor-ka, bandhigga sawir-qaadista, aaladaha caafimaadka iyo meelaha kale.

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Astaamaha

Mabda'a shaqada:

1. Isku xidhka laysarka: laysarka garaaca (UV/cagaar/infrared) ayaa diiradda lagu saarayaa gudaha dareeraha dareeraha ah si loo sameeyo kanaal gudbin tamar oo deggan.

2. Hagitaan dareere ah: jet-xawaaraha sare (heerka socodka 50-200m/s) qaboojinta aagga wax lagu farsameeyo iyo qaadista qashinka si looga fogaado ururinta kulaylka iyo wasakhowga.

3. Ka saarista walxaha: Tamarta laysarka waxay keentaa saameyn cavitation ah oo ku jirta dareeraha si loo gaaro habayn qabow oo walxaha ah (aagga ay saameysay kulaylka <1μm).

4. Xakamaynta firfircoonida: hagaajinta waqtiga-dhabta ah ee xuduudaha laysarka (awoodda, soo noqnoqoshada) iyo cadaadiska jet-ka si loo daboolo baahiyaha agabka iyo qaab-dhismeedka kala duwan.

Xuduudaha Muhiimka ah:

1. Awoodda laysarka: 10-500W (la hagaajin karo)

2. Dhexroorka Jet-ka: 50-300μm

3. Saxnaanta Mashiinka: ±0.5μm (jarista), saamiga qoto dheer ilaa ballaca 10:1 (qodista)

Faa'iidooyinka farsamada:

(1) Ku dhawaad wax khasaare ah oo kulayl ah ma jiro
- Qaboojinta jet-ka dareeraha ah waxay xakameysaa aagga ay saameysay kulaylka (HAZ) ilaa **<1μm**, iyadoo laga fogaanayo dildilaacyo yaryar oo ay keento habka laysarka caadiga ah (HAZ badanaa waa >10μm).

(2) Mashiinka saxda ah ee aadka u sarreeya
- Saxnaanta jarista/qodista ilaa **±0.5μm**, qallafsanaanta geeska Ra<0.2μm, waxay yareysaa baahida loo qabo rinjiyeynta xigta.

- Taageer habaynta qaab-dhismeedka 3D ee adag (sida godadka koonka, godadka qaabaysan).

(3) Waafaqsanaanta ballaaran ee walxaha
- Alaab adag oo jilicsan: SiC, safayr, galaas, dhoobo (hababka dhaqameedku way fududahay in la burburiyo).

- Alaabada xasaasiga u ah kulaylka: polymers, unugyada bayoolojiga (khatar uma laha in kulaylka la baabi'iyo).

(4) Ilaalinta deegaanka iyo hufnaanta
- Ma jiro wasakhowga boodhka, dareeraha waa la dib u warshadeyn karaa oo la sifeyn karaa.

- Kordhinta 30%-50% ee xawaaraha farsamaynta (marka la barbar dhigo farsamaynta).

(5) Xakamaynta caqliga leh
- Meelaynta muuqaalka ee isku dhafan iyo hagaajinta xuduudaha AI, dhumucda walxaha la qabsan kara iyo cilladaha.

Tilmaamaha farsamada:

Mugga miiska saaran	300300150	400400200
Dhidibka toosan XY	Matoor toosan. Matoor toosan	Matoor toosan. Matoor toosan
Dhidibka toosan Z	150	200
Saxnaanta booska μm	+/-5	+/-5
Saxnaanta booska ee soo noqnoqda μm	+/-2	+/-2
Dardargelinta G	1	0.29
Xakamaynta tirooyinka	3 dhidib / 3+1 dhidib / 3+2 dhidib	3 dhidib / 3+1 dhidib / 3+2 dhidib
Nooca xakamaynta tirooyinka	DPSS Nd:YAG	DPSS Nd:YAG
Mowjadaha hirarka nm	532/1064	532/1064
Awoodda lagu qiimeeyay W	50/100/200	50/100/200
Diyaarad biyo ah	40-100	40-100
Baarka cadaadiska biiyaha	50-100	50-600
Cabbirka (qalabka mashiinka) (ballaca * dhererka * dhererka) mm	144519442260	170015002120
Cabbirka (kabadhka xakamaynta) (W * L * H)	70025001600	70025001600
Miisaanka (qalabka) T	2.5	3
Miisaanka (kabadhka xakamaynta) KG	800	800
Awoodda farsamaynta	Qalafsanaanta dusha sare Ra≤1.6um Xawaaraha furitaanka ≥1.25mm/s Goynta wareegga ≥6mm/s Xawaaraha goynta toosan ≥50mm/s	Qalafsanaanta dusha sare Ra≤1.2um Xawaaraha furitaanka ≥1.25mm/s Goynta wareegga ≥6mm/s Xawaaraha goynta toosan ≥50mm/s
	Loogu talagalay kiristaalka gallium nitride, agabka semiconductor-ka ee farqiga band-ka aadka u ballaaran (dheeman/gallium oxide), agabka gaarka ah ee hawada sare, substrate-ka dhoobada kaarboonka LTCC, sawir-qaadista, kiristaalka scintillator iyo qalabka kale ee wax lagu farsameeyo. Fiiro gaar ah: Awoodda farsamaynta way kala duwan tahay iyadoo ku xiran sifooyinka maaddada

Kiiska farsamaynta:

Adeegyada XKH:

XKH waxay bixisaa taageero adeeg oo dhammaystiran oo loogu talagalay qalabka teknoolojiyadda laser-ka microjet, laga bilaabo horumarinta habka hore iyo la-tashiga xulashada qalabka, ilaa is-dhexgalka nidaamka ee muddada dhexe ee la habeeyey (oo ay ku jiraan isku-xidhka gaarka ah ee isha laser-ka, nidaamka jet-ka iyo module-ka otomaatiga ah), ilaa tababarka hawlgalka iyo dayactirka dambe iyo hagaajinta habka joogtada ah, geeddi-socodka oo dhan waxaa lagu qalabeeyay taageero koox farsamo oo xirfad leh; Iyada oo lagu saleynayo 20 sano oo waayo-aragnimo makiinada saxda ah, waxaan bixin karnaa xalal hal-joojin ah oo ay ku jiraan xaqiijinta qalabka, soo bandhigida wax soo saarka ballaaran iyo jawaab degdeg ah oo iibka kadib ah (24 saacadood oo taageero farsamo ah + kaydka qaybaha muhiimka ah) ee warshadaha kala duwan sida semiconductor-ka iyo caafimaadka, waxaanan ballan qaadaynaa dammaanad 12 bilood ah iyo adeeg dayactir iyo casriyeyn cimri dheer ah. Hubi in qalabka macaamiisha uu had iyo jeer ilaaliyo waxqabadka iyo xasilloonida warshadda hormuudka ka ah.